Contact openings and an electronic component formed from the sam

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...

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257 71, 257413, 257640, 257906, 257755, H01L 27108, H01L 2976, H01L 2358, H01L 2904

Patent

active

058083200

ABSTRACT:
A method for forming a contact opening is described and which includes providing a node location to which electrical connection is to be made; forming a conductive line adjacent the node location, the conductive line having a conductive top and sidewall surfaces; forming electrically insulative oxide in covering relation relative to the top surface of the conductive line; forming electrically insulative nitride sidewall spacers over the conductive sidewall surfaces, the nitride sidewall spacers projecting outwardly of the conductive line top conductive surface, the electrically insulative oxide positioned between the nitride sidewall spacers; forming an electrically insulative layer outwardly of the conductive line, and the node location; and etching a contact opening to the node location or the top surface through the electrically insulative layer substantially selective relative to the nitride sidewall spacers.

REFERENCES:
patent: 5162890 (1992-11-01), Butler
patent: 5166096 (1992-11-01), Cote et al.
patent: 5173752 (1992-12-01), Motonami et al.
patent: 5272367 (1993-12-01), Dennison et al.
patent: 5444003 (1995-08-01), Wang et al.
patent: 5510648 (1996-04-01), Davies et al.
patent: 5552620 (1996-09-01), Lu et al.
patent: 5710450 (1998-01-01), Chau et al.

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