Contact module for a low height multi-chip carrier socket

Details Contact module for a low height multi-chip carrier socket Contact module for a low height multi-chip carrier socket

1990-11-01

1991-11-05

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439525, 29842, H01R 909

Patent

active

050628020

ABSTRACT:
A contact module and method for making a connector for socketing an IC chip carrier is disclosed. The contact module comprised a relatively short body containing a plurality of contacts arranged on a standard center to center spacing, and a locking member. A positioning plate is fabricated having features, such as holes, along its edges for receiving other features, such as projections, formed in the contact modules. A number of the contact modules are assembled to the positioning plate to correspond to a particular chip carrier configuration. The plate and contact modules are then aligned with the pads of a substrate and terminal portions of the contacts are then soldered to the pads. The positioning plate is then removed. The chip carrier is then placed in the connector formed by the contact modules and a locking member inserted into each contact module for contacting the chip carrier leads.

REFERENCES:
patent: 3993384 (1976-11-01), Dennis et al.
patent: 4395084 (1983-07-01), Conrad
patent: 4445736 (1984-05-01), Hopkins
patent: 4699593 (1987-10-01), Grabbe et al.
patent: 4872845 (1989-10-01), Korsunsky et al.

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