Contact module and connector having the same

Electrical connectors – Coupling part with actuating means urging contact to move... – Having open slot for receiving preformed panel circuit...

Reexamination Certificate

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Details

C439S632000

Reexamination Certificate

active

06796822

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to connectors used for electrically connecting such as electronic devices and contact modules provided in the connectors.
2. Description of the Related Art
Connectors are used for electrically connecting a plurality of electronic devices or electronic components.
The connectors are classified into various types according to the shapes and the like.
For example, according to the mounting patterns, the connectors can be classified as connectors for boards connected to boards, LSI sockets connected to LSIs, and relay connectors used for connecting cables to cables.
Among the above described various connectors, the connectors for boards, for example, can be further divided into two major categories: the card edge type and the two piece type.
Card edge type connectors shown in
FIGS. 1 and 2
are used for connection between a mother board
1
and a daughter card
2
. The card edge type connectors are constructed such that a pair of contacts (terminals)
4
hold tight pads
3
provided on patterns (not shown) formed on both sides of the daughter card
2
. In other words, the patterns of the daughter card
2
are used as the insertion side. A connector
5
a
in
FIG. 1
is a throughhole mounting type connector that is mounted on the mother board
1
by inserting, soldering and fixing one end of each of the contacts
4
in a throughhole (not shown) formed on the mother board
1
. A connector
5
b
in
FIG. 2
is a surface mounting type connector that is mounted on the mother board
1
by soldering and fixing one end of each of the contacts
4
to a pad
6
formed on the mother board
1
.
A two piece type connector
5
c
shown in
FIG. 3
is used such that two connectors
5
c
-
1
and
5
c
-
2
, a receiving connector and an inserting connector, are mounted on two boards
1
and
7
, respectively, and the two connectors
5
c
-
1
and
5
c
-
2
are made to fit.
As mentioned above, there are differences in the connector shapes depending on the mounting patterns. However, each of the above-described connectors for boards, LSI sockets and relay connectors is constructed such that a lot of contacts formed into pin shapes or tongue shapes using a metal material are accommodated in a housing (designated by reference numeral
8
in
FIGS. 1 through 3
) formed by insulating resin.
If the contacts are of press fit types and have pin-like shapes, for example, the contacts are formed by notching, stamp-out pressing, bending, or form pressing a flat metal material. In addition, if the contacts are formed into a tongue shape, similarly, a flat metal material is notched or stamp-out pressed so as to obtain a lot of contacts. Normally, spring characteristics are given to the contacts by using a plate made of a metal material. Also, the contacts are plated with gold after performing base plating thereon so as to obtain good electric conductivity.
By the way, it is required that the connectors possess predetermined characteristics as connecting components as well as electrical characteristics that will be described later.
That is, when mounting the connector to a board or the like, it is preferable that force required for connecting contacts of the connector to such as electrodes of the board, in other words, force required for inserting the connector to a connecting hole or the like of the board, be small. Further, it is necessary that the contacts positively establish contact with such as electrodes of the board after the insertion. Thus, the so-called LIF (Low Insertion Force) structure is used in which spring characteristics are given to the contacts so that great contact force is exerted after the insertion of the contact with a small contact force.
On the other hand, at the insertion of the contact, it is not preferable that the contacts be worn or damaged such that the contact slidably contact such as the electrode. For this reason, the so-called ZIF (Zero Insertion Force) structure is also used in which the contacts and such as electrodes are maintained in a non-contact state and the contacts do not slidably contact such as electrode until the completion of the connection (insertion). Additionally, from these points of view, various shapes and materials of the contacts, various methods for surface treatment and the like are developed.
Regarding the connector, in addition to the above-described specific characteristics, similar to electric components such as a distributing board, a smaller connector, higher-density (narrower pitch) mounting of the contacts, speeding up of transmission rate, that is, improvement of the transmission rate and noise reduction by controlling such as crosstalk are always required.
A conventional connector, however, is formed into a pin shape and the like as described above. Thus, it is reasonable to say that there is a limit to the smaller connector or the higher-density mounting of the contacts. For example, as for the higher-density mounting of the contacts, it is difficult to make the pitch between the contacts equal to or less than 0.2-0.3 mm.
Additionally, since the conventional connector is formed with a three dimensional structure as mentioned above, the conventional connector is designed and manufactured by simulation through a three dimensional CAD or CAE such that the electric characteristics meet a predetermined specification. However, since the shape is complex, it is difficult to control the variation of the characteristic impedance to fall within a range of ±10%. Hence, it is difficult to eliminate noise due to impedance mismatching.
SUMMARY OF THE INVENTION
It is a general object of the present invention to provide an improved and useful contact module and connector having the contact module in which the above-mentioned problems are eliminated.
It is another and more specific object of the present invention to provide a contact module and connector having the contact module that can realize a smaller apparatus (connector) and higher-density mounting of the contacts to be mounted and perform impedance matching with good accuracy.
In order to achieve the above-mentioned objects, according to one aspect of the present invention, there is provided a contact module that includes: a strip base; a plurality of first protrusions continuously extending from a first end of the base and including the same materials as the base, said first protrusions each having a first contact portion and having spring characteristics at least in a part including said first contact portion; and a plurality of second protrusions continuously extending from a second end of the base and including the same material as the base, said second protrusions each having a second contact portion and having spring characteristics at least in a part including said second contact portion, the second end being opposite to the first end; wherein said base comprises a sheet made of a metal material, an insulating film formed on at least one side of said sheet, and a film including a noble metal material formed on the insulating film, wherein said film forming said first and second contact portions and circuit patterns, said circuit patterns being formed between the first and second contact portions; wherein the first and second contact portions and the circuit patterns integrally form a plurality of contacts, said contacts each comprising one of the first contact portions, a corresponding one of the second contact portions, and the circuit pattern therebetween.
Also, according to another aspect of the present invention, there is provided a connector including: a connector body; and at least one pair of the above-described contact modules provided in the connector body in a mutually opposing manner, the connector body including a pair of press members pressing the contact portions backward and forward so as to change the distance between the opposing first contact portions of the pair of the contact modules.
Here, the circuit patterns includes one of wiring patterns and wires according to specific embodiments.

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