Contact method for thin silicon carbide epitaxial layer and...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Bipolar transistor

Reexamination Certificate

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C257S192000, C257S192000, C257S194000, C257S195000, C257S196000, C257S197000, C257S199000, C257S200000, C257S201000, C257S743000, C257S744000, C257S745000, C257SE29188, C257SE21371, C257SE21541, C438S309000, C438S312000, C438S313000, C438S314000, C438S315000, C438S316000, C438S317000

Reexamination Certificate

active

07638820

ABSTRACT:
Provided is a process for forming a contact for a compound semiconductor device without electrically shorting the device. In one embodiment, a highly doped compound semiconductor material is electrically connected to a compound semiconductor material of the, same conductivity type through an opening in a compound semiconductor material of the opposite conductivity type. Another embodiment discloses a transistor including multiple compound semiconductor layers where a highly doped compound semiconductor material is electrically connected to a compound semiconductor layer of the same conductivity type through an opening in a compound semiconductor layer of the opposite conductivity type. Embodiments further include metal contacts electrically connected to the highly doped compound semiconductor material. A substantially planar semiconductor device is disclosed. In embodiments, the compound semiconductor material may be silicon carbide.

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