Contact mechanism for test head of semiconductor test system

Details Contact mechanism for test head of semiconductor test system Contact mechanism for test head of semiconductor test system

1996-01-24

1998-05-19

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324758, G01R 3102

Patent

active

057540578

ABSTRACT:
A contact mechanism is for a test head of a semiconductor test system for connecting the test head to a wafer prober or a test handler having a semiconductor device to be tested. The contact mechanism includes, a performance board mounted between the test head the wafer prober wherein the performance board has a guide hole, an insert ring mounted on a frame of the wafer prober, a probe card mounted on a central portion of the insert ring for contacting the semiconductor device to be tested, a contactor having a plurality of contact pins to achieve electric contact between the performance board and the probe card when pressed in downward by the performance board, a performance board shaft extending from a bottom of the test head and penetrating the guide hole of the performance board, a shaft clamp provided on the insert ring having a shaft guide hole to receive the performance board shaft therethrough wherein a bottom of the shaft guide hole is lower than a surface of the insert ring. In another aspect, the contact mechanism further includes a test head elevator to assist the vertical movement of the test head by reducing the weight of the test head.

REFERENCES:
patent: 4488111 (1984-12-01), Widdowson
patent: 5172053 (1992-12-01), Itoyama
patent: 5321453 (1994-06-01), Mori et al.
patent: 5489853 (1996-02-01), Nakajima
patent: 5521522 (1996-05-01), Abe et al.
patent: 5656943 (1997-08-01), Montoya et al.

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