Contact mechanism for IC testing

Details Contact mechanism for IC testing Contact mechanism for IC testing

1996-02-09

1998-09-01

Abrams, Neil

Electrical connectors

Aligning means for dual inline package

H05K 100

Patent

active

058002057

ABSTRACT:
A contact mechanism for connecting the leads of an IC package to an IC tester comprises a carrier block provided with an opening to receive therein an IC package provided with leads on its side surfaces, an IC connector connected to the IC tester, and a shifting mechanism for shifting the IC package received in the opening of the carrier block toward the IC connector after the carrier block has been joined to the IC connector, to bring the leads of the IC package into contact with the corresponding electrodes of the IC connector. The opening of the carrier block is tapered downward so that the leads of the IC package is guided by the inclined side surfaces of the opening as the IC package is pushed down toward the IC connector to position the leads of the IC package correctly relative to the corresponding electrodes of the IC connector.

REFERENCES:
patent: 4750890 (1988-06-01), Dube et al.
patent: 5161678 (1992-11-01), Garvey
patent: 5208529 (1993-05-01), Tsurishima et al.
patent: 5269401 (1993-12-01), Ito et al.
patent: 5574383 (1996-11-01), Saito et al.

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