Contact-making system for semiconductor wire connections

Details Contact-making system for semiconductor wire connections Contact-making system for semiconductor wire connections

1993-03-16

1993-11-23

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 10, 228102, 219 5621, H01L 2160

Patent

active

052636313

ABSTRACT:
A contact-making system for wire connections on electronic components in semiconductor connection technology, which includes a contact-making device having a capillary tube arranged thereon for guiding a bonding wire, and at least one electrode, which is allocated to the head piece of the capillary tube, for producing a spark transfer, by which spark transfer a bonding-wire endpiece which projects from the head piece is melted to form a bonding-wire sphere, the bonding-wire sphere being uniformly shaped and arranged concentrically with respect to the bonding wire or with respect to the bonding-wire endpiece by providing at least two or more electrodes which are distributed uniformly on the circumference with respect to the head piece or to the bonding-wire endpiece and are in each case effectively connected to an independent power unit, which is constructed as a current source, it being possible to activate the power units from a single control unit.

REFERENCES:
Patent Abstracts of Japan, vol. 5, No. 149, [E075], Sep. 19, 1981.
Patent Abstracts of Japan, vol. 6, No. 189, [E133], Sep. 29, 1982.
Patent Abstracts of Japan, vol. 8, No. 231, [E274], Oct. 24, 1984.
Patent Abstracts of Japan, vol. 12, No. 395, [E671], Oct. 20, 1988.

Affiliated with

Also associated with

Rating

Contact-making system for semiconductor wire connections does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Contact-making system for semiconductor wire connections, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Contact-making system for semiconductor wire connections will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1842049