Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-01-29
2008-01-29
Wilczewski, Mary (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S121000, C257S686000, C257S726000, C257S727000, C257S785000
Reexamination Certificate
active
07323363
ABSTRACT:
A integrated circuit housing includes a first clamping hardware, a second clamping hardware operatively connected to the first clamping hardware, and an integrated circuit stack comprising a top portion and a bottom portion, wherein the first clamping hardware contacts the top portion and the second clamping hardware contacts the bottom portion, and wherein a first shim is interposed between the bottom portion and the second clamping hardware.
REFERENCES:
patent: 6297960 (2001-10-01), Moden et al.
patent: 2003/0132529 (2003-07-01), Yeo et al.
patent: 2005/0117305 (2005-06-01), Ulen et al.
Kearns Donald A.
McElfresh David K.
Zacharisen George C.
Osha•Liang LLP
Sun Microsystems Inc.
Tran Thanh Y.
Wilczewski Mary
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