Contact joint for semiconductor chip carriers

Details Contact joint for semiconductor chip carriers Contact joint for semiconductor chip carriers

1989-01-26

1989-08-29

Hille, Rolf

357 80, 357 68, H01L 2330, H01L 2304, H01L 2314

Patent

active

048622478

ABSTRACT:
A chip carrier (34) having a peripheral edge (40), a bottom surface (42) and an inwardly directed arcuate connecting surface (44) is provided. The chip carrier (34) is connected to a printed wiring board (36) by solder (38). The solder (38) adheres to the metallized portion (46) on the chip carrier (34) and the metallized portion (48) on the printed wiring board (36). The connecting surface (44) allows stress to be more evenly distributed to reduce the occurrence of the cracks in the solder (38) which cause failure of the circuit.

REFERENCES:
patent: 4463217 (1984-07-01), Orcutt
patent: 4510519 (1985-04-01), Dubois et al.
patent: 4703393 (1987-10-01), Yamamoto et al.
patent: 4706105 (1987-01-01), Masuda et al.

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