Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-06-06
2006-06-06
Gushi, Ross (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S066000
Reexamination Certificate
active
07056131
ABSTRACT:
A scalable, low cost, reliable, compliant, low profile, low insertion force, high-density, separable and reconnectable electrical connection for high speed, high performance electronic circuitry and semiconductors. The electrical connection can be used to make, for example, electrical connections from one Printed Circuit Board (PCB) to another PCB, MPU, NPU, or other semiconductor device.
REFERENCES:
patent: 3543587 (1970-12-01), Kawada
patent: 3634807 (1972-01-01), Grobe et al.
patent: 3670409 (1972-06-01), Reimer
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 4998885 (1991-03-01), Beaman
patent: 5152695 (1992-10-01), Grabbe et al.
patent: 5173055 (1992-12-01), Grabbe
patent: 5199879 (1993-04-01), Kohn et al.
patent: 5228861 (1993-07-01), Grabbe
patent: 5257950 (1993-11-01), Lenker et al.
patent: 5292558 (1994-03-01), Heller et al.
patent: 5358411 (1994-10-01), Mroczkowski et al.
patent: 5366380 (1994-11-01), Reymond
patent: 5468655 (1995-11-01), Greer
patent: 5483741 (1996-01-01), Akram et al.
patent: 5530288 (1996-06-01), Stone
patent: 5532612 (1996-07-01), Liang
patent: 5590460 (1997-01-01), DiStefano et al.
patent: 5593903 (1997-01-01), Beckenbaugh et al.
patent: 5629837 (1997-05-01), Barabi et al.
patent: 5632631 (1997-05-01), Fjelstad et al.
patent: 5772451 (1998-06-01), Dozier et al.
patent: 5791911 (1998-08-01), Fasano et al.
patent: 5802699 (1998-09-01), Fjelstad et al.
patent: 5812378 (1998-09-01), Fjelstad et al.
patent: 5842273 (1998-12-01), Schar
patent: 5860585 (1999-01-01), Rutledge et al.
patent: 5896038 (1999-04-01), Budnaitis et al.
patent: 5934914 (1999-08-01), Fjelstad et al.
patent: 5967797 (1999-10-01), Maldonado
patent: 5980335 (1999-11-01), Barbieri et al.
patent: 5989994 (1999-11-01), Khoury et al.
patent: 6019611 (2000-02-01), McHugh et al.
patent: 6031282 (2000-02-01), Jones et al.
patent: 6032356 (2000-03-01), Eldridge et al.
patent: 6042387 (2000-03-01), Jonaidi
patent: 6063640 (2000-05-01), Mizukoshi et al.
patent: 6083837 (2000-07-01), Millet
patent: 6133534 (2000-10-01), Fukutomi et al.
patent: 6146151 (2000-11-01), Li
patent: 6156484 (2000-12-01), Bassous et al.
patent: 6184699 (2001-02-01), Smith et al.
patent: 6196852 (2001-03-01), Neumann et al.
patent: 6200143 (2001-03-01), Haba et al.
patent: 6204065 (2001-03-01), Ochiai
patent: 6205660 (2001-03-01), Fjelstad et al.
patent: 6208157 (2001-03-01), Akram et al.
patent: 6221750 (2001-04-01), Fjelstad
patent: 6224392 (2001-05-01), Fasano et al.
patent: 6250933 (2001-06-01), Khoury et al.
patent: 6255727 (2001-07-01), Khoury
patent: 6264477 (2001-07-01), Smith et al.
patent: 6293806 (2001-09-01), Yu
patent: 6293808 (2001-09-01), Ochiai
patent: 6297164 (2001-10-01), Khoury et al.
patent: 6298552 (2001-10-01), Li
patent: 6306752 (2001-10-01), DiStefano et al.
patent: 6335210 (2002-01-01), Farooq et al.
patent: 6336269 (2002-01-01), Eldridge et al.
patent: 6337575 (2002-01-01), Akram
patent: 6361328 (2002-03-01), Gosselin
patent: 6373267 (2002-04-01), Hiroi
patent: 6374487 (2002-04-01), Haba et al.
patent: 6392524 (2002-05-01), Biegelsen et al.
patent: 6392534 (2002-05-01), Flick
patent: 6399900 (2002-06-01), Khoury et al.
patent: 6402526 (2002-06-01), Schreiber et al.
patent: 6420661 (2002-07-01), Di Stefano et al.
patent: 6420789 (2002-07-01), Tay et al.
patent: 6420884 (2002-07-01), Khoury et al.
patent: 6428328 (2002-08-01), Haba et al.
patent: 6436802 (2002-08-01), Khoury
patent: 6437591 (2002-08-01), Farnworth et al.
patent: 6442039 (2002-08-01), Schreiber
patent: 6452407 (2002-09-01), Khoury et al.
patent: 6461892 (2002-10-01), Beroz
patent: 6472890 (2002-10-01), Khoury et al.
patent: 6474997 (2002-11-01), Ochiai
patent: 6492251 (2002-12-01), Haba et al.
patent: 6517362 (2003-02-01), Hirai et al.
patent: 6520778 (2003-02-01), Eldridge et al.
patent: 6524115 (2003-02-01), Gates et al.
patent: 6551112 (2003-04-01), Li et al.
patent: 6576485 (2003-06-01), Zhou et al.
patent: 6604950 (2003-08-01), Maldonado et al.
patent: 6612861 (2003-09-01), Khoury et al.
patent: 6616966 (2003-09-01), Mathieu et al.
patent: 6622380 (2003-09-01), Grigg
patent: 6627092 (2003-09-01), Clements et al.
patent: 6640432 (2003-11-01), Mathieu et al.
patent: 6661247 (2003-12-01), Maruyama et al.
patent: 6664131 (2003-12-01), Jackson
patent: 6671947 (2004-01-01), Bohr
patent: 6677245 (2004-01-01), Zhou et al.
patent: 6700072 (2004-03-01), DiStefano et al.
patent: 6719569 (2004-04-01), Ochiai
patent: 6730134 (2004-05-01), Neidich
patent: 6736665 (2004-05-01), Zhou et al.
patent: 6750136 (2004-06-01), Zhou et al.
patent: 6791171 (2004-09-01), Mok et al.
patent: 6815961 (2004-11-01), Mok et al.
patent: 6847101 (2005-01-01), Fjelstad et al.
patent: 6848173 (2005-02-01), Fjelstad et al.
patent: 2002/0011859 (2002-01-01), Smith et al.
patent: 2002/0055282 (2002-05-01), Eldridge et al.
patent: 2002/0058356 (2002-05-01), Oya
patent: 2002/0079120 (2002-06-01), Eskildsen et al.
patent: 2002/0129894 (2002-09-01), Liu et al.
patent: 2002/0133941 (2002-09-01), Akram et al.
patent: 2002/0146919 (2002-10-01), Cohn
patent: 2002/0179331 (2002-12-01), Brodsky et al.
patent: 2003/0035277 (2003-02-01), Saputro et al.
patent: 2003/0089936 (2003-05-01), McCormack et al.
patent: 2003/0096512 (2003-05-01), Cornell
patent: 2003/0099097 (2003-05-01), Mok et al.
patent: 2003/0129866 (2003-07-01), Romano et al.
patent: 2003/0147197 (2003-08-01), Uriu et al.
patent: 2003/0194832 (2003-10-01), Lopata et al.
patent: 0692823 (1996-01-01), None
patent: 1208241 (2003-01-01), None
patent: 2000011443 (2000-04-01), None
patent: 2001203435 (2001-07-01), None
patent: 9602068 (1996-01-01), None
patent: 9744859 (1997-11-01), None
patent: 0213253 (2002-02-01), None
An article entitled “Patented Socketing System for the BGA/CSP Technology” by E-tec Interconnect Ltd., pp. 1-4.
Gary B. Kromann et al., “Motorola's PowerPC 603 and PowerPC 604 RISC Microprocessor: the C4/Ceramic-ball-grid Array Interconnect Technology”, Motorola Advanced Packaging Technology, Motorola, Inc., 1996, pp. 1-10.
Ravi Mahajan et al., “Emerging Directions for Packaging Technologies”, Intel Technology Journal, V. 6, Issue 02, May 16, 2002, pp. 62-75.
Gushi Ross
Michael Bednarek Pillsbury Winthrop Shaw Pittman LLP
Neoconix Inc.
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