Alloys or metallic compositions – Copper base – Noble metal containing
Patent
1990-02-27
1991-09-03
Roy, Upendra
Alloys or metallic compositions
Copper base
Noble metal containing
200262, 200264, 200266, 420495, C22C 900, C22C 3002
Patent
active
050452819
ABSTRACT:
A contact forming material for a vacuum interrupter comprising: from 25% to 65% by weight of a highly conductive component comprising Ag and Cu, and from 35% to 75% by weight of an arc-proof component selected from the group consisting of Ti, V, Cr, Zr, Mo, W and their carbides and borides, and mixtures thereof wherein the highly conductive component of the contact forming material comprises (i) a first highly conductive component region composed of a first discontinuous phase having a thickness or width of no more than 5 micrometers and a first matrix surrounding the first discontinuous phase, and (ii) a second highly conductive component region composed of a second discontinuous phase having a thickness or width of at least 5 micrometers and a second matrix surrounding the second discontinuous phase, wherein the first discontinuous phase in the first highly conductive component region is finely and uniformly dispersed in the first matrix at intervals of no more than 5 micrometers, and wherein the amount of the second highly conductive component region based on the total highly conductive component is within the range of from 10% to 60% by weight.
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Chiba Seishi
Honma Mitsutaka
Okawa Mikio
Okutomi Tsutomu
Satoh Yoshinari
Kabushiki Kaisha Toshiba
Roy Upendra
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