Contact for semiconductor components

Details Contact for semiconductor components Contact for semiconductor components

2006-02-07

2006-02-07

Nguyen, Vinh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S765010

Reexamination Certificate

active

06995577

ABSTRACT:
An interconnect for testing semiconductor components includes a substrate, and contacts on the substrate for making temporary electrical connections with bumped contacts on the components. Each contact includes a recess and a support member over the recess configured to electrically engage a bumped contact. The support member is suspended over the recess on spiral leads formed on a surface of the substrate. The spiral leads allow the support member to move in a z-direction within the recess to accommodate variations in the height and planarity of the bumped contacts. In addition, the spiral leads twist the support member relative to the bumped contact to facilitate penetration of oxide layers thereon. The spiral leads can be formed by attaching a polymer substrate with the leads thereon to the substrate, or by forming a patterned metal layer on the substrate. In an alternate embodiment contact, the support member is suspended over the surface of the substrate on raised spring segment leads.

REFERENCES:
patent: 4329642 (1982-05-01), Luthi et al.
patent: 4937653 (1990-06-01), Blonder et al.
patent: 5006792 (1991-04-01), Malhi et al.
patent: 5046239 (1991-09-01), Miller et al.
patent: 5073117 (1991-12-01), Malhi et al.
patent: 5137461 (1992-08-01), Bindra et al.
patent: 5172050 (1992-12-01), Swapp
patent: 5196726 (1993-03-01), Nishiguchi et al.
patent: 5329423 (1994-07-01), Scholz
patent: 5341564 (1994-08-01), Akhavain et al.
patent: 5419807 (1995-05-01), Akram et al.
patent: 5420520 (1995-05-01), Anschel et al.
patent: 5478779 (1995-12-01), Akram
patent: 5481205 (1996-01-01), Frye et al.
patent: 5483741 (1996-01-01), Akram et al.
patent: 5500605 (1996-03-01), Chang
patent: 5519332 (1996-05-01), Wood et al.
patent: 5539324 (1996-07-01), Wood et al.
patent: 5541525 (1996-07-01), Wood et al.
patent: 5559444 (1996-09-01), Farnworth et al.
patent: 5578526 (1996-11-01), Akram et al.
patent: 5592736 (1997-01-01), Akram et al.
patent: 5625298 (1997-04-01), Hirano et al.
patent: 5629837 (1997-05-01), Barabi et al.
patent: 5663654 (1997-09-01), Wood et al.
patent: 5686317 (1997-11-01), Akram et al.
patent: 5691041 (1997-11-01), Frankeny et al.
patent: 5783461 (1998-07-01), Hembree
patent: 5796264 (1998-08-01), Farnworth et al.
patent: 5802699 (1998-09-01), Fjelstad et al.
patent: 5810609 (1998-09-01), Faraci et al.
patent: 5815000 (1998-09-01), Farnworth et al.
patent: 5834945 (1998-11-01), Akram et al.
patent: 5878485 (1999-03-01), Wood et al.
patent: 5900674 (1999-05-01), Wojnarowski et al.
patent: 5931685 (1999-08-01), Hembree et al.
patent: 5962921 (1999-10-01), Farnworth et al.
patent: 5973394 (1999-10-01), Slocum et al.
patent: 6016060 (2000-01-01), Akram et al.
patent: 6040702 (2000-03-01), Hembree et al.
patent: 6072326 (2000-06-01), Akram et al.
patent: 6086386 (2000-07-01), Fjelstad et al.
patent: 6091252 (2000-07-01), Akram et al.
patent: 6107109 (2000-08-01), Akram et al.
patent: 6188301 (2001-02-01), Kornrumpf et al.
patent: 6200143 (2001-03-01), Haba et al.
patent: 6208156 (2001-03-01), Hembree
patent: 6208157 (2001-03-01), Akram et al.
patent: 6222280 (2001-04-01), Farnworth et al.
patent: 6232243 (2001-05-01), Farnworth et al.
patent: 6242932 (2001-06-01), Hembree
patent: 6294837 (2001-09-01), Akram et al.
patent: 6310484 (2001-10-01), Akram et al.
patent: 6313651 (2001-11-01), Hembree et al.
patent: 6314641 (2001-11-01), Akram
patent: 6329829 (2001-12-01), Farnworth et al.
patent: 6333555 (2001-12-01), Farnworth et al.
patent: 6337577 (2002-01-01), Doherty et al.
patent: 6437451 (2002-08-01), Farnworth et al.
patent: 6517362 (2003-02-01), Hirai et al.
patent: 6708399 (2004-03-01), Farnworth et al.
patent: 6853210 (2005-02-01), Farnworth et al.
Information displayed at Chip Con 1997-1998, 4 sheets, on GE CRD Floating Point Technology, month unavailable.

Affiliated with

Also associated with

Rating

Contact for semiconductor components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Contact for semiconductor components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Contact for semiconductor components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3686066