Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
1999-04-29
2001-02-27
Patel, T. C. (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S083000, C439S874000
Reexamination Certificate
active
06193523
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a contact for an electrical connector. More specifically, the present invention relates to a compressive contact in an electrical connector that engages a pad on a circuit substrate.
2. Brief Description of Earlier Developments
Generally speaking, each new generation of an electronic product involves a miniaturization of the previous generation. Mobile telephones provide an excellent example. The size of each new generation of mobile telephones has consistently decreased from the previous generation of mobile telephones.
Miniaturization reduces the space available for the electronic components used in the product. While undoubtedly affecting electronic component design, the reduced size of the electronic components in the product also affects the design of the connectors used in the product. One design consideration as a result of miniaturization occurs in the X-Y plane of the connector. Miniaturization may require that the same number of contacts engage a smaller electronic component. In other words, the number of contacts per unit area of the connector, also known as contact density, must increase.
Another design consideration as a result of miniaturization occurs along the Z-axis of the connector. Miniaturization may limit the height of the connector. In a board-to-board interconnect, for example, product size may determine the maximum allowable spacing between boards. The interconnect must fit in the space between the boards.
Current electrical connector designs, while suitable for current generations of electronic products, may not be suitable for subsequent generations of electronic products. Thus, a need exists for electrical connectors capable of use in next generation electronic products.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide an improved contact for use in an electrical connector.
It is a further object of the present invention to provide a contact having a non-linear wiping action.
It is a further object of the present invention to provide a compressive contact
It is a further object of the present invention to provide a low profile height electrical connector.
It is a further object of the present invention to provide an electrical connector that is inexpensive to manufacture.
It is a further object of the present invention to provide a surface mounted board-to-board electrical connector.
It is a further object of the present invention to provide a low profile BGA connector.
These and other objects of the present invention are achieved in one aspect of the present invention by a contact for use in an electrical connector that interconnects a first circuit substrate and a second circuit substrate. The contact has an intermediate portion; a mounting portion extending from the intermediate portion for securing the contact to the first circuit substrate; and a mating portion extending from the intermediate portion and adapted to provide a non-linear wiping action to the second circuit substrate upon deflection of the mating portion by the second circuit substrate.
These and other objects of the present invention are achieved in another aspect of the present invention by a contact used in an electrical connector, formed from a sheet of material and comprising: a mounting portion for mounting the connector to a first circuit substrate; and a mating portion for engaging a second circuit substrate. The mating portion has an edge that engages the second circuit substrate.
These and other objects of the present invention are achieved in another aspect of the present invention by an electrical connector that interconnects a first circuit substrate and a second circuit substrate. The connector comprises: an insulative housing; and a contact. The contact has a intermediate portion located in the housing; a mounting portion extending from the intermediate portion for securing the connector to the first circuit substrate; and a mating portion extending from the intermediate portion and adapted to provide an arcuate wiping action to the second circuit substrate upon deflection of the mating portion by the second circuit substrate.
These and other objects of the present invention are achieved in another aspect of the present invention by a method of making a contact, comprising the steps of: providing a sheet of conductive material; stamping a shape from the material, the shape including: an intermediate portion having a medial section and opposed ends; a mounting portion extending from the intermediate portion; and an arch-shaped mating portion extending from the intermediate portion and having an edge; and bending the opposed ends at an angle relative to the medial section. The edge of the mating portion is adapted to engage a circuit substrate.
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Berg Technology Inc.
Hamilla Brian J.
Page M. Richard
Patel T. C.
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