Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1990-06-13
1991-05-28
Bradley, Paula A.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 72, 439514, H01R 909, H01R 3108
Patent
active
050189816
ABSTRACT:
A contact equipped with a bypass element has a contact portion element at one end of a warped element and a male terminal at the other end thereof. The contact comprises a bypass element disposed within the warped element. One end of the bypass element is formed of a rigid portion element and the other end thereof is formed of an elastic portion element. An area at a connecting portion between the rigid portion element and the elastic portion element and a free end of the rigid portion element are contacted with the inner surface between one end and the other end of the warped element to short the circuit between the contact portion element and the male terminal. A free end of the elastic portion element is abutted against an inner surface on the warped side of the warped element in order to elastically support the rigid portion element.
REFERENCES:
patent: 4354729 (1982-10-01), Grabbe et al.
patent: 4359252 (1982-11-01), Olsson et al.
patent: 4513353 (1985-04-01), Bakermans et al.
patent: 4683423 (1987-07-01), Morton
patent: 4758176 (1988-07-01), Abe et al.
patent: 4874333 (1989-10-01), Reed
patent: 4921430 (1990-05-01), Matsuoka
Electronics-Sep. 1986; AMP's New VLSI Package Squeezes in 320 Leeds pp. 46-47.
Bradley Paula A.
Yamaichi Electric Mfg. Co. Ltd.
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