Contact element for use in electroplating

Details Contact element for use in electroplating Contact element for use in electroplating

2005-05-03

2005-05-03

Abrams, Neil (Department: 2839)

Electrical connectors

Metallic connector or contact having movable or resilient...

Spring actuated or resilient securing part

C200S279000, C204S297140

Reexamination Certificate

active

06887113

ABSTRACT:
It is difficult to transmit large processing current on the surfaces of printed circuit boards (L) using clamp-type contact organs (6, 7). In order to solve said problem, contact elements (15, 16) having one or more contact surfaces (26) are disposed on the contact organs (6, 7). The shape of the contact surfaces (26) are configured in such a way that no damages occur in the areas of the conductive surfaces adjacent to the contact surfaces (26) when large currents are transmitted from the contact elements (15, 16) printed on the electrically conductive surface of printed board material (L) on the contact surfaces to the conductive surface.

REFERENCES:
patent: 2248718 (1941-07-01), Owen
patent: 2339996 (1944-01-01), Kight
patent: 4085997 (1978-04-01), Hainsworth
patent: 4385967 (1983-05-01), Brady et al.
patent: 4755271 (1988-07-01), Hosten
patent: 4767146 (1988-08-01), Haase
patent: 4776939 (1988-10-01), Blasing et al.
patent: 4879007 (1989-11-01), Wong
patent: 5391276 (1995-02-01), Astor et al.
patent: 5401370 (1995-03-01), Kauper et al.
patent: 5456814 (1995-10-01), Metzka
patent: 5901997 (1999-05-01), Bayer
patent: 25 12 762 (1976-09-01), None
patent: 30 27 751 (1982-02-01), None
patent: 32 36 545 (1983-05-01), None
patent: 36 24 481 (1988-01-01), None
patent: 36 45 319 (1988-01-01), None
patent: 37 26 571 (1989-03-01), None
patent: 40 05 209 (1991-08-01), None
patent: 41 06 733 (1992-09-01), None
patent: 29721741 (1998-04-01), None
patent: 0 254 962 (1987-07-01), None
patent: 0 578 699 (1992-04-01), None
patent: PCTEP97/01544 (1997-03-01), None
patent: PCTCA97/00350 (1997-05-01), None
patent: WO 9746740 (1997-12-01), None
patent: PCTDE98/03477 (1998-11-01), None

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