Heat exchange – Structural installation – Related to wall – floor or ceiling structure of a chamber
Reexamination Certificate
2005-06-28
2005-06-28
Ford, John K (Department: 3753)
Heat exchange
Structural installation
Related to wall, floor or ceiling structure of a chamber
C165S171000, C165S135000, C165S168000, C165S049000, C062S451000, C237S069000
Reexamination Certificate
active
06910526
ABSTRACT:
In order to improve the heat-conducting connection between a contact element (3) and a ceiling panel (1) which are adhesively bonded to one another, the contact panel (5) of the contact element (3) is provided with an adhesive depression (10) in the contact surface (6), said depression taking up only part of said contact surface, while the remaining part of the latter rests directly against the upper side of the ceiling panel (1). The contact panel (5) may be elastically or plastically deformable, e.g. along a bending groove (9), with the result that it adapts more easily to irregularities, such as those caused, for example, by slight sagging of the ceiling panel (1). This permits larger widths of the contact panel (5) without impairing the thermal contact. In order to ensure close abutment of the parts of the contact surface (6) which are not adhesively bonded to the upper side of the ceiling panel (1), the contact panel (5) can be appropriately prestressed.
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Von Helmuth Sokolean, “Kühldeckentechnologie zur Erreichung des bestmöglichen Raumkomforts,” Architektur und Technik, pp. 49-53.
Barcol-Air AG
Finnegan Henderson Farabow Garrett & Dunner LLP
Ford John K
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