Contact clip

Details Contact clip Contact clip

1977-08-10

1979-02-20

Wojciechowicz, Edward J.

357 71, 357 79, H01L 2348

Patent

active

041410289

ABSTRACT:
A contact clip, primarily for use in semiconductor devices comprises a layer of material having a relatively high coefficient of thermal expansion and another layer of relatively low coefficient of thermal expansion. Such a clip improves the contact between the clip and the semiconductor pellet to which it is soldered not only during device assembly but also at high operating temperatures as well.

REFERENCES:
patent: 3111352 (1963-11-01), Theodoseau
patent: 3896544 (1975-07-01), Fosnough

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