Contact carriers (tiles) for populating larger substrates...

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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Reexamination Certificate

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07140883

ABSTRACT:
An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

REFERENCES:
patent: 3379937 (1968-04-01), Shepherd et al.
patent: 3702982 (1972-11-01), Kelley et al.
patent: 3781683 (1973-12-01), Freed
patent: 3849728 (1974-11-01), Evans
patent: 3963986 (1976-06-01), Morton et al.
patent: 4032058 (1977-06-01), Riseman
patent: 4087747 (1978-05-01), Deegen et al.
patent: 4357062 (1982-11-01), Everett
patent: 4508405 (1985-04-01), Damon et al.
patent: 4522893 (1985-06-01), Bohlen et al.
patent: 4528500 (1985-07-01), Lightbody et al.
patent: 4553192 (1985-11-01), Babuka
patent: 4565314 (1986-01-01), Scholz
patent: 4636722 (1987-01-01), Ardezzone
patent: 4724383 (1988-02-01), Hart
patent: 4740410 (1988-04-01), Muller et al.
patent: 4811081 (1989-03-01), Lyden
patent: 4837622 (1989-06-01), Whann et al.
patent: 4899099 (1990-02-01), Mendenhall et al.
patent: 4899106 (1990-02-01), Ogura
patent: 4918032 (1990-04-01), Jain et al.
patent: 4932883 (1990-06-01), Hsia et al.
patent: 4953834 (1990-09-01), Ebert et al.
patent: 4965865 (1990-10-01), Trenary
patent: 4972580 (1990-11-01), Nakamura
patent: 4983907 (1991-01-01), Crowley
patent: 4998885 (1991-03-01), Beaman
patent: 5172050 (1992-12-01), Swapp
patent: 5175491 (1992-12-01), Ewers
patent: 5187020 (1993-02-01), Kwon et al.
patent: 5191708 (1993-03-01), Kasukabe et al.
patent: 5210939 (1993-05-01), Mallik et al.
patent: 5225777 (1993-07-01), Bross et al.
patent: 5236118 (1993-08-01), Bower et al.
patent: 5276395 (1994-01-01), Malloy
patent: 5278442 (1994-01-01), Prinz et al.
patent: 5311405 (1994-05-01), Tribbey et al.
patent: 5312456 (1994-05-01), Reed et al.
patent: 5371654 (1994-12-01), Beaman et al.
patent: 5373627 (1994-12-01), Grebe
patent: 5393375 (1995-02-01), MacDonald et al.
patent: 5395253 (1995-03-01), Crumly
patent: 5418471 (1995-05-01), Kardos
patent: 5422574 (1995-06-01), Kister
patent: 5440231 (1995-08-01), Sugai
patent: 5473510 (1995-12-01), Dozier, II
patent: 5476211 (1995-12-01), Khandros
patent: 5476818 (1995-12-01), Yanof
patent: 5477160 (1995-12-01), Love
patent: 5491426 (1996-02-01), Small
patent: 5495667 (1996-03-01), Farnworth
patent: 5497079 (1996-03-01), Yamada et al.
patent: 5525912 (1996-06-01), Momohara
patent: 5534784 (1996-07-01), Lum et al.
patent: 5555422 (1996-09-01), Nakano
patent: 5569272 (1996-10-01), Reed et al.
patent: 5576630 (1996-11-01), Fujita
patent: 5593322 (1997-01-01), Swamy et al.
patent: 5601740 (1997-02-01), Eldridge et al.
patent: 5629631 (1997-05-01), Perry et al.
patent: 5635846 (1997-06-01), Beaman et al.
patent: 5657207 (1997-08-01), Schreiber et al.
patent: 5672978 (1997-09-01), Kimura
patent: 5691650 (1997-11-01), Sugai
patent: 5736850 (1998-04-01), Legal
patent: 5741144 (1998-04-01), Elco et al.
patent: 5772451 (1998-06-01), Dozier, II et al.
patent: 5786701 (1998-07-01), Pedder
patent: 5806181 (1998-09-01), Khandros et al.
patent: 5821763 (1998-10-01), Beaman et al.
patent: 5829128 (1998-11-01), Eldridge et al.
patent: 5832601 (1998-11-01), Eldridge et al.
patent: 5864946 (1999-02-01), Eldridge et al.
patent: 5914614 (1999-06-01), Beaman et al.
patent: 5917707 (1999-06-01), Khandros et al.
patent: 5920200 (1999-07-01), Pendse et al.
patent: 5923178 (1999-07-01), Higgins et al.
patent: 5974662 (1999-11-01), Eldridge et al.
patent: 5994152 (1999-11-01), Khandros et al.
patent: 5998864 (1999-12-01), Khandros et al.
patent: 6008543 (1999-12-01), Iwabuchi
patent: 6029344 (2000-02-01), Khandros et al.
patent: 6050829 (2000-04-01), Eldridge et al.
patent: 6053395 (2000-04-01), Sasaki
patent: 6064213 (2000-05-01), Khandros et al.
patent: 6110823 (2000-08-01), Eldridge et al.
patent: 6133744 (2000-10-01), Yojima et al.
patent: 6174744 (2001-01-01), Watanabe et al.
patent: 6184053 (2001-02-01), Eldridge et al.
patent: 6229324 (2001-05-01), Akram et al.
patent: 6640415 (2003-11-01), Eslamy et al.
patent: 6690185 (2004-02-01), Khandros et al.
patent: 6741085 (2004-05-01), Khandros et al.
patent: 2003/0192176 (2003-10-01), Eldridge et al.
patent: 2004/0058487 (2004-03-01), Eslamy et al.
patent: 42 37 591 (1994-05-01), None
patent: 19610123 (1997-10-01), None
patent: 061 615 (1982-03-01), None
patent: 369 112 (1989-07-01), None
patent: 460822 (1991-12-01), None
patent: 54-146581 (1979-11-01), None
patent: 62-197073 (1987-12-01), None
patent: 63-268285 (1988-11-01), None
patent: 2-144869 (1990-02-01), None
patent: 05-256874 (1993-10-01), None
patent: 6265575 (1994-09-01), None
patent: 6-342600 (1994-12-01), None
patent: 7-94558 (1995-04-01), None
patent: 8-15318 (1996-01-01), None
patent: WO 91/12706 (1991-08-01), None
patent: WO 96/15458 (1996-05-01), None
patent: WO 96/38858 (1996-12-01), None
patent: WO 97/43653 (1997-11-01), None
patent: WO 97/43656 (1997-11-01), None
patent: WO 98/21597 (1998-05-01), None
“High Density Probe Assembly,” 2244 Research Disclosure, No. 333 (Emsworth GB Jan. 1992).
Burbank et al., “Automatic Test Equipment Translator Board”, IBM Technical Disclosure Bulletin, vol. 21, No. 4, pp. 1404-1405, Sep. 1997.
Humenik, “Flexible Probe Contact”, IBM Technical Brochure, vol. 22, No. 6, p. 2286, Nov. 1979.
Renz, U., “Multipoint Test Probe for Printed Cards”, IBM Technical Disclosure Bulletin, vol. 17, No. 2, pp. 459-460, Jul. 1974.
Renz, U., “Test Probe Contact Grid Translator Board”, IBM Technical Disclosure Bulletin, vol. 21, No. 8, pp. 3235-3236, Jan. 1979.
Soejima, “New Probe Microstructure for Full-Wafer Contact-Probe Cards”, 1999 IEEE, 1999 Electronic Components and Technology Conference, 6 pages (1999).
U.S. Appl. No. 09/327,116, filed Jun. 7, 1999, Eslamy et al.

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