Metal fusion bonding – Solder form
Reexamination Certificate
2006-03-07
2006-03-07
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Solder form
Reexamination Certificate
active
07007834
ABSTRACT:
Contact bump construction (27) and method for the production of a contact bump construction for the formation of elevated contact sites on connecting surfaces (22) of a substrate (21), particularly chip connecting surfaces, with a spacer metallization (28) for the attainment of a defined height of the contact bump construction, wherein the spacer metallization (28) consists at least partly of annealed copper.
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Adams Evans P.A.
Johnson Jonathan
PAC Tech—Packaging Technologies GmbH
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