Contact between element to be driven and thin film...

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material

Reexamination Certificate

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Details

C257S072000, C257S347000

Reexamination Certificate

active

07102163

ABSTRACT:
A TFT for controlling the power supplied to an element to be driven, such as an organic EL element which operates based on the supplied power, is provided between the element to be driven and a power supply line VL. The TFT and the element to be driven are electrically connected by a wiring layer. The contact position between the wiring layer and the TFT and the contact position between the wiring layer and the element to be driven are positioned so as to be distant from each other. Alternatively, at least the contact hole region of a first electrode of the element is covered by a flattening layer. With this structure, it is possible to realize a flatter surface on which to form, for example, the emissive layer of the element to be driven.

REFERENCES:
patent: 5124776 (1992-06-01), Tanizawa et al.
patent: 5897328 (1999-04-01), Yamauchi et al.
patent: 5986632 (1999-11-01), Takayama et al.
patent: 6326249 (2001-12-01), Yamazaki et al.
patent: 6369507 (2002-04-01), Arai
patent: 6420200 (2002-07-01), Yamazaki et al.
patent: 6781153 (2004-08-01), Anzai
Copy of Office Action for corresponding Korean Patent Application No. 10-2004-0095111 with English excerpt translation.
Copy of Korean Patent Laid-Open Publication No. 1993-0003838 and U.S. Patent 5,124,776 (both corresponding to Korean Patent Registration No. 0063966.
Copy of Korean Patent Laid-Open Publication No. 1999-26, which was cited in Korean Patent Appln. 10-2004-0095111, with its English translation excerpt.
Handbook of Multilevel Metallization for Integrated Circuits Materials, Technology, and Applications, Noyes Publications, Westwood, NJ, USA, 1993, p. 357, 386, and 389.

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