Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1991-06-12
1992-11-17
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 62, 439 79, 439108, 439682, 439858, 439886, H01R 909, H01R 2372
Patent
active
051638355
ABSTRACT:
A contact assembly with at least one signal contact and at least one ground contact, in particular for use in a connector or the like, comprises a support of resilient conductive material, an insulating intermediate layer provided on the support and at least one signal conductor supported on the insulating intermediate layer. The support is used as ground conductor and two or more adjacent contacts pads are provided for each signal conductor or each group of signals conductors adjacent a first edge of the support. One contact pad is connected with the support and the other contact pad(s) is (are) connected to the respective signal conductors.
REFERENCES:
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patent: 4911643 (1990-03-01), Perry et al.
patent: 4913656 (1990-04-01), Gordon
IBM Bulletin, Dunman, vol. 7, No. 3, p. 182, Aug. 1964.
IBM Technical Disclosure Documents, vol. 32, No. 7, p. 200, Dec. 1989--NY, N.Y.
Morlion Danny L. C.
Schoss Udo H.
Abrams Neil
Burndy Corporation
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