Contact assembly and socket for use with semiconductor packages

Details Contact assembly and socket for use with semiconductor packages Contact assembly and socket for use with semiconductor packages

2007-05-15

2007-05-15

Dinh, Phuong (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

11326302

ABSTRACT:
In a contact assembly, a first set of contacts (30-1through30-5) is arranged on a first surface and a second set of contacts (40-5through4-1) is arranged on a second surface with respective contacts of each set used as pairs. A plurality of first and second sets are stacked one on top of another separated by insulators, the first terminal portions (12) of respective first and the second sets of contacts are aligned in the direction of stacking and the second terminal portions (20) of the first and second sets of contacts are arranged in such a fashion as to be symmetrical relative to a median line. The pitch (P2) of the second terminal portions (20) of the first and the second sets of contacts is expanded to a greater degree than the pitch (P1) of the first terminal portions (12) in two preferred embodiments. The pitch of the second terminal portions of a contact assembly (200) having two first and two second sets of contacts is also shown expanded in the stacking direction in one embodiment forming a zigzag pattern of the second terminal portions.

REFERENCES:
patent: 5844418 (1998-12-01), Wood et al.
patent: 6575767 (2003-06-01), Satoh et al.
patent: 6709279 (2004-03-01), Uratsuji
patent: 6749443 (2004-06-01), Sano et al.
patent: 2004-152554 (2004-05-01), None
patent: 3566691 (2004-06-01), None

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