Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1992-07-14
1994-01-11
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439108, 439825, 439886, H01R 2370
Patent
active
052775925
ABSTRACT:
A contact assembly, in particular for a connector for electrical connection between printed circuit boards, comprising a support of resilient conductive material, an insulation layer disposed on the support and at least one signal conductor disposed on the insulation layer, wherein each signal conductor includes signal contact pads. The support functions as ground conductor. In the insulation layer adjacent the signal contact pad(s) an opening is provided to expose a part of the support as associated ground contact pad.
The contact assemblies are manufactured by attaching a tape of conductive material to a tape of insulation material. A pattern of signal conductors is made from the tape of conductive material by means of a photolithographic process. Openings are formed in the tape of insulation material and said tape of insulation material with its side opposite to the signal conductors is attached on a support tape of resilient conductive material. Finally, contact assemblies with a plurality of signal conductors are punched out of the assembled tape.
REFERENCES:
patent: 4886461 (1989-12-01), Smith
patent: 5163835 (1992-11-01), Morlion et al.
Abrams Neil
Burndy Corporation
LandOfFree
Contact assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Contact assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Contact assembly will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1627566