Chemistry: electrical and wave energy – Apparatus – Electrolytic
Reexamination Certificate
2005-06-28
2005-06-28
Phasge, Arun S. (Department: 1753)
Chemistry: electrical and wave energy
Apparatus
Electrolytic
C204S286100, C204S297010, C204S297060, C204S297070, C204S297080, C204S297090, C204S297100, C204S297140
Reexamination Certificate
active
06911127
ABSTRACT:
Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path. The contact members can comprise electrically conductive biasing elements, such as fingers, that have a contact site and a dielectric coating covering at least a portion of the biasing elements. The contact members can also have a raised feature configured to engage the seed-layer on the workpiece for conducting the current to the seed-layer.
REFERENCES:
patent: 4137867 (1979-02-01), Aigo
patent: 4246088 (1981-01-01), Murphy et al.
patent: 4259166 (1981-03-01), Whitehurst
patent: 4304641 (1981-12-01), Grandia et al.
patent: 4341629 (1982-07-01), Uhlinger
patent: 4422915 (1983-12-01), Wielonski et al.
patent: 4466864 (1984-08-01), Bacon et al.
patent: 4576685 (1986-03-01), Goffredo et al.
patent: 4685414 (1987-08-01), DiRico
patent: 4913085 (1990-04-01), Vöhringer et al.
patent: 5135636 (1992-08-01), Yee et al.
patent: 5139818 (1992-08-01), Mance
patent: 5227041 (1993-07-01), Brogden et al.
patent: 5271953 (1993-12-01), Litteral
patent: 5310580 (1994-05-01), O'Sullivan et al.
patent: 5344491 (1994-09-01), Katou
patent: 5389496 (1995-02-01), Calvert et al.
patent: 5441629 (1995-08-01), Kosaki
patent: 5443707 (1995-08-01), Mori
patent: 5447615 (1995-09-01), Ishida
patent: 5522975 (1996-06-01), Andricacos et al.
patent: 5550315 (1996-08-01), Stormont
patent: 5597460 (1997-01-01), Reynolds
patent: 5597836 (1997-01-01), Hackler et al.
patent: 5609239 (1997-03-01), Schlecker
patent: 5670034 (1997-09-01), Lowery
patent: 5744019 (1998-04-01), Ang
patent: 5747098 (1998-05-01), Larson
patent: 5776327 (1998-07-01), Botts et al.
patent: 5788829 (1998-08-01), Joshi et al.
patent: 5843296 (1998-12-01), Greenspan
patent: 5904827 (1999-05-01), Reynolds
patent: 5932077 (1999-08-01), Reynolds
patent: 5985126 (1999-11-01), Bleck et al.
patent: 6001235 (1999-12-01), Arken et al.
patent: 6080291 (2000-06-01), Woodruff et al.
patent: 6139712 (2000-10-01), Patton et al.
patent: 6156167 (2000-12-01), Patton et al.
patent: 6228231 (2001-05-01), Uzoh
patent: 6251236 (2001-06-01), Stevens
patent: 6303010 (2001-10-01), Woodruff et al.
patent: 6309520 (2001-10-01), Woodruff et al.
patent: 6309524 (2001-10-01), Woodruff et al.
patent: WO 99/25904 (1999-05-01), None
patent: WO 99/25905 (1999-05-01), None
patent: WO 00/03072 (2000-01-01), None
patent: WO 00/32835 (2000-06-01), None
U.S. Appl. No. 09/386,558, filed Aug. 31, 1999, Woodruff et al.
Batz, Jr. Robert W.
Chen Lin-Lin
Klocke John L.
Pedersen John M.
Perkins Coie LLP
Phasge Arun S,.
Semitool Inc.
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