Contact assemblies, methods for making contact assemblies,...

Details Contact assemblies, methods for making contact assemblies,... Contact assemblies, methods for making contact assemblies,...

2005-11-08

2005-11-08

Phasge, Arun S. (Department: 1753)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S280000, C204S286100, C204S297010, C204S297060, C204S297070, C204S297080, C204S297090, C204S297100, C204S297140

Reexamination Certificate

active

06962649

ABSTRACT:
Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblies can comprise a support member that includes an inner wall which defines an opening configured to receive the workpiece and a plurality of contacts. The individual contacts include a conductor and a cover. The conductor can comprise a proximal section projecting inwardly into the opening relative to the support member, a distal section extending from the proximal section, and an inert exterior at least at the distal section. The cover comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.

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International Search Report for PCT/US02/39244; Applicant Semitool, Inc.; Mar. 18, 2003; 7 pgs.

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