Contact aligning structure in IC socket

Electrical connectors – Aligning means for dual inline package

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H05K 100

Patent

active

055624928

ABSTRACT:
In an IC socket, a downward movement of a pressing member imparts a downwardly directed force to an IC body or IC terminal portions and causes a resilient downward shifting of contact point portions of contacts which are implanted in a socket body, and by reaction thereof, a contact pressure between the contact point portions and the IC terminal portions is realized. A contact aligning structure for this IC socket includes a side pressing portion which is caused to press the contact point portions so as to be resiliently forwardly shifted when the pressing member is moved downwardly, an aligning surface for aligning the contact point portions being defined by that surface of the side pressing portion which is caused to press the contact point portions.

REFERENCES:
patent: Re32370 (1987-03-01), Bright et al.
patent: 3846737 (1974-11-01), Spaulding
patent: 4872845 (1989-10-01), Korsunsky et al.
patent: 5102346 (1992-04-01), Soes
patent: 5348483 (1994-09-01), Sagano

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