Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2011-08-23
2011-08-23
Dickey, Thomas L (Department: 2893)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C257SE21156
Reexamination Certificate
active
08003432
ABSTRACT:
A method for forming a thin film photovoltaic device. The method includes providing a transparent substrate comprising a surface region. The method forms a first electrode layer overlying the surface region of the transparent substrate. The method also forms a thin layer of indium material, using a sputtering target of indium material, overlying the first electrode layer to act as an intermediary glue layer to facilitate attachment to the first electrode layer. In a specific embodiment, the method forms a copper material overlying the thin layer of indium material. The method also forms an indium layer overlying the copper material to form a multi layered structure including at least the thin layer of indium material, copper material, and the indium layer. In a preferred embodiment, the multi-layered structure has a first thickness. In a specific embodiment, the method also subjects at least the multi-layered structure to thermal treatment process in an environment containing a sulfur bearing species to form a copper indium disulfide alloy material while consuming substantially all of the indium layer from at least the treatment process of the multi-layered structure. In a preferred embodiment, the copper indium disulfide alloy material comprises an atomic ratio of copper indium ranging from about 1.35 to about 3.00. In a specific embodiment, the copper indium disulfide alloy material has a second thickness of more than two times of the first thickness of the multi-layered structure. The method consumes substantially all of the thin layer of indium material into a portion of the copper indium disulfide alloy material during at least the thermal treatment process. The method causes formation of a copper sulfide material overlying the copper indium disulfide alloy material during at least the thermal treatment process.
REFERENCES:
patent: 4996108 (1991-02-01), Divigalpitiya et al.
patent: 5125984 (1992-06-01), Kruehler et al.
patent: 5261968 (1993-11-01), Jordan
patent: 5501744 (1996-03-01), Albright et al.
patent: 5536333 (1996-07-01), Foote et al.
patent: 5578503 (1996-11-01), Karg et al.
patent: 5665175 (1997-09-01), Safir
patent: 6307148 (2001-10-01), Takeuchi et al.
patent: 6328871 (2001-12-01), Ding et al.
patent: 2003/0011047 (2003-01-01), Cunningham et al.
patent: 2006/0220059 (2006-10-01), Satoh et al.
patent: 2007/0089782 (2007-04-01), Scheuten et al.
patent: 2007/0151596 (2007-07-01), Nasuno et al.
patent: 2007/0169810 (2007-07-01), Van Duren et al.
patent: 2008/0041446 (2008-02-01), Wu et al.
patent: 2008/0092945 (2008-04-01), Munteanu et al.
patent: 2008/0092953 (2008-04-01), Lee
Ellmer et al., Copper Indium Disulfide Solar Cell Absorbers Prepared in a One-Step Process by Reactive Magnetron Sputtering from Copper and Indium Targets; Elsevier Science B.V; Thin Solid Films 413 (2002) pp. 92-97.
International Search Report & Written Opinion of PCT Application No. PCT/US 09/46161, date of mailing Jul. 27, 2009, 14 pages total.
International Search Report & Written Opinion of PCT Application No. PCT/US 09/46802, mailed on Jul. 31, 2009, 11 pages total.
Onuma et al., Preparation and Characterization of CuInS Thin Films Solar Cells with Large Grain, Elsevier Science B.V; Solar Energy Materials & Solar Cells 69 (2001) pp. 261-269.
Dickey Thomas L
Kilpatrick Townsend & Stockton LLP
Stion Corporation
Yushin Nikolay
LandOfFree
Consumable adhesive layer for thin film photovoltaic material does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Consumable adhesive layer for thin film photovoltaic material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Consumable adhesive layer for thin film photovoltaic material will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2740546