Construction to improve thermal performance and reduce die...

Details Construction to improve thermal performance and reduce die... Construction to improve thermal performance and reduce die...

2006-12-05

2006-12-05

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S706000, C438S122000

Reexamination Certificate

active

07145232

ABSTRACT:
A semiconductor package construction aimed at improving thermal performance. A heatspreader is provided having a metal alloy preform attached to it already. Then, a few dots of conductive epoxy are dispensed around the die. The heatspreader with the preformed metal alloy is pressed on the adhesive and then the part is cured. By coupling the die to the heatspreader with conductive epoxy, the die is constrained from warping. By removing the necessity of coating the die, the cost of fabrication is reduced. There is only a very marginal cost increase in the back end for dispensing the dots. For this, the process and equipment already exists in the backend. By reducing die backside warpage due, the die remains in good contact with the heatspreader, thus improving thermal performance.

REFERENCES:
patent: 4654966 (1987-04-01), Kohara et al.
patent: 5744863 (1998-04-01), Culnane et al.
patent: 5866943 (1999-02-01), Mertol
patent: 6323066 (2001-11-01), Lai et al.
patent: 6472762 (2002-10-01), Kutlu
patent: 6590292 (2003-07-01), Barber et al.
patent: 6681482 (2004-01-01), Lischner et al.
patent: 2005/0224955 (2005-10-01), Desai et al.

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