Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-07-12
2005-07-12
Vigushin, John B. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S769000, C361S787000, C361S789000, C439S054000, C439S074000, C439S876000, C439S912000
Reexamination Certificate
active
06917525
ABSTRACT:
Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates. Alternate card assembly structures comprise a compliant carrier structure, such as a decal or screen, which is adhesively attached to the probe chip substrate.
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Chong Fu Chiung
Haemer Joseph Michael
Lahiri Syamal Kumar
Mok Sammy
Swiatowiec Frank John
Glenn Michael A.
Glenn Patent Group
NanoNexus, Inc.
Vigushin John B.
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