Construction for high density power module package

Details Construction for high density power module package Construction for high density power module package

2005-12-13

2005-12-13

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S717000, C361S718000, C257S675000, C257S717000

Reexamination Certificate

active

06975513

ABSTRACT:
A high-density power module package wherein the circuits and a part of chips of the power module are formed on respective substrates such that the circuit patterns are not influenced by the chips. Accordingly, the density of the circuit can be improved so as to save the required area of substrate and production cost.

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