Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2002-04-16
2004-06-01
Vigushin, John B. (Department: 2827)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S749000, C349S150000, C349S152000, C257S797000, C029S830000
Reexamination Certificate
active
06744638
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a construction and a method for interconnecting a flexible printed circuit and a wiring board and a Liquid Crystal Display (LCD) device and method for manufacturing the same and, more particularly to, the construction and the method for interconnecting, for example, a Tape Carrier Package (TCP) and the wiring board and the LCD device with this interconnection construction and the method for manufacturing the same. The present application claims priority of Japanese Patent Application No. 2001-117553 filed on Apr. 16, 2001, which is hereby incorporated by reference.
2. Description of the Related Art
An LCD device is manufactured by a process of filling a gap between a TFT (Thin Film Transistor) board and a CF (Color Filter) board with liquid crystal to form an LCD panel and then connecting to the LCD panel a TCP mounted with a driver IC (Integrated Circuit) for driving the LCD panel and connecting to the TCP a wiring board for supplying a signal and power.
In this process, conventionally, when interconnecting the TCP and the wiring board, for example, they are aligned with each other by superposing alignment markers, one on the other, such alignment holes made in the TCP and the wiring board respectively beforehand or a pit and a spike formed at a predetermined region of an edge of an input terminal portion of the TCP and an output terminal portion of the wiring board respectively.
These alignment hole and pit (spike) used as the alignment markers are, however, formed by a step different from that for forming a circuit pattern, so that an error occurs in a relative position between the alignment markers and the circuit pattern, thus giving rise to misalignment between the TCP and the wiring board.
Further, by such method of using the pit or the spike as the alignment markers, when the pit is formed, there occurs a decrease in area for interconnecting the input terminal portion of the TCP and the output terminal portion of the wiring board; when the spike is formed, on the other hand, there occurs such an defect that when the input terminal portion of the TCP and the output terminal portion of the wiring board are interconnected, the spike may butt against a mating terminal portion, thus damaging it.
To guard against it, for example, Japan Patent No. 2730572 discloses a method by which when a circuit pattern is formed on a TCP and a wiring board, simultaneously a dummy lead and a dummy land are formed as an alignment marker independently of this original circuit pattern so that the dummy lead and the dummy land may be superposed one on the other for alignment of the two.
By this method, specifically, as shown n
FIG. 18A
, TCPs
102
are connected to an LCD panel
100
and, for example, rightmost and leftmost TCPs
102
are aligned with a wiring board
101
to then connect it to each of the TCPs
102
.
The following will describe a configuration of the TCP
102
and that of the wiring board
101
.
As Shown in
FIG. 18A
, in each TCP
102
, at a mounting portion of a tape carrier having insulation and flexibility is mounted a driver IC
104
for driving the LCD panel
100
.
The tape carrier
103
is made up of a insulated flexible base film (not shown) and such a circuit pattern (not shown) formed thereon as to include an input terminal portion
105
and an output terminal portion
106
.
The input terminal portion
105
, as shown in
FIGS. 18A
,
19
, and
21
, has a plurality of linear terminals
105
1
,
105
2
, . . . ,
105
n
(For example, n=384). Outside the outermost terminals
105
1
and
105
n
are further formed dummy leads
103
a
,
103
a.
Also, as shown in
FIGS. 18A
,
12
B,
19
, and
21
, the insulated flexible base film (not shown) is cut at a predetermined region at its both side to form notches
107
,
107
, in which the dummy leads
103
a
,
103
a
are formed so that later described U-shaped dummy lands
113
,
113
can be recognized visually.
The notch
107
is specifically formed as a recess so that its upper edge
108
and lower edge
109
may extend perpendicularly to an extension direction (length direction) of linear terminals
105
1
,
105
2
, . . . ,
105
n
making up the input terminal portion
105
.
The wiring board
101
is, as shown in
FIG. 18B
, made up of an insulating board
110
and such a circuit pattern formed thereon as to include output terminal portions
111
connected to the input terminal portions
105
of the TCPs
102
.
Each of the output terminal portions
111
has n number of terminals
112
1
,
112
2
, . . . ,
112
n
that correspond to the input terminal portion
105
. Also, as shown in
FIGS. 18B
,
20
and
22
, for example outside the outermost terminal
112
1
of the leftmost output terminal portion
111
and outside the outermost terminal
112
n
of the rightmost output terminal portion
111
are formed the U-shaped dummy lands
113
,
113
.
The following will describe a method of alignment in connecting a wiring board
101
to each TCP
102
.
First, an Anisotropic Conductive Film (ACF) is mounted on each output terminal portion
111
of the wiring board
101
, which is then arranged on the back side of the TCP
102
in such a manner that each output terminal portion
111
may face the input terminal portion
105
of each TCP
102
.
Next, in both of the outermost TCPs
102
, the dummy leads
103
a
are superposed on the vertical portion of the u-shaped dummy lands
113
in alignment perpendicular to the extension direction of the input terminal portion
105
(output terminal portion
111
).
Next, as shown in
FIGS. 23 and 24
, alignment is performed in the extension direction of the input terminal portion
105
so that the U-shaped dummy land
113
may be put in the notch
107
, that the upper edge
108
of the notch
107
may be aligned with an outer upper edge
114
of the U-shaped dummy land
113
, and that the lower edge
109
of the notch
107
may be aligned with an outer lower edge
115
of the U-shaped dummy land
113
.
Next, by using a heat tool, it is performed to heat the TCP
102
and the wiring board
101
to a predetermined temperature under pressure, thus interconnecting the TCP
102
and the wiring board
101
.
According to the above-mentioned conventional technology, however, it is necessary to preserve on the TCP
102
a region for providing the dummy leads
103
a
,
103
a
besides the terminals
105
1
,
105
2
, . . . ,
105
n
, thus leading to a problem that the TCP
102
must be widened.
This problem in turn leads to another problem that when a number of TCPs
102
are connected on a high-definition LCD panel having a large number of picture elements, the mutually adjacent ones of these TCPs
102
may interfere with each other in some cases
If an inter-terminal pitch is decreased to reduce a width of the TCP
102
, on the other hand, there occurs such a problem of short-circuiting, thus deteriorating reliability
SUMMARY OF THE INVENTION
In view of the above, it is an object of the invention to provide a construction and method for interconnecting a TCP and a wiring board and an LCD device and method for manufacturing the same that are capable of accurate alignment and reducing a width of the TCP without deteriorating reliabilities of the interconnection.
According to a first aspect of the present invention, there is provided an interconnecting construction for interconnecting a flexible printed circuit and a wiring board, the flexible printed circuit including: a first circuit pattern forced on one face or two faces of an flexible base film and a semi conductor device mounted at a predetermined region of the insulated flexible base film; and said wiring board including an insulated board on one face or two faces of which is formed a second circuit pattern for receiving a signal or transmitting it to the flexible printed circuit, wherein:
the predetermined region of the insulated flexible base film is formed on the insulated flexible base film so as to face the wiring board, constitutes the first circuit pattern, and is c
Choate Hall & Stewart
NEC LCD Technologies Ltd.
Vigushin John B.
LandOfFree
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