Construction and manufacturing process for drop on demand print

Details Construction and manufacturing process for drop on demand print Construction and manufacturing process for drop on demand print

1996-10-17

1999-02-16

Powell, William

Etching a substrate: processes

Forming or treating thermal ink jet article

216 2, 216 16, 216 56, H01L 2100, B44C 122

Patent

active

058716564

ABSTRACT:
A construction and manufacturing process for drop on demand print heads provides electrothermal heating elements which are in close proximity to the tip of the nozzle, and therefore achieve efficient thermal coupling to the ink.
The construction utilizes metal layer electrodes formed as part of a CMOS drive circuit fabrication on a silicon wafer. A nozzle tip hole is then etched with an axis generally normal to the electrode layers. A heater substance and a passivation layer are deposited on the wafer. These layers are then anisotropically etched, leaving heater and passivation layers on the vertical sidewalls of the nozzle tip hole. Ink channels and nozzle barrels are then etched in the wafer, preferably using an etchant which has a high selectivity against the passivation layer and heater material, such as EDP.

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