Constructing of an electronic assembly having a decoupling...

Details Constructing of an electronic assembly having a decoupling... Constructing of an electronic assembly having a decoupling...

2005-04-26

2005-04-26

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C257S691000, C257S686000, C257S738000, C257S777000

Reexamination Certificate

active

06884939

ABSTRACT:
An electronic assembly is provided, having a capacitor interconnected between BGA solder balls. The capacitor is placed on a motherboard and soldered to the BGA solder balls when the BGA solder balls are soldered to electric lands on the motherboard.

REFERENCES:
patent: 20030218235 (2003-11-01), Searls et al.

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