Constraining core for surface mount technology

Details Constraining core for surface mount technology Constraining core for surface mount technology

1994-11-08

1998-05-19

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 428137, 428209, 428901, 428 95, H05H 720

Patent

active

057544034

ABSTRACT:
A thermal core (10) including aluminum layer (12) held between two molybdenum layers (14) for dissipating heat from a plurality of chip carriers (22). Core (10) has the ability to withstand excessive vibrational loads while being lightweight. Bonding molybdenum/aluminum/molybdenum layers (12, 14) creates a core (10) having an increased stiffness factor which surpasses military vibrational requirements. Additionally, due to the low density of porous aluminum layer (12), weight limitations set forth by the military can also be met.

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CRC "Materials Science and Engineering" Haueback, Second Edition, pp. 269-273, 1996.

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