Acoustics – Diaphragm and enclosure
Patent
1996-10-30
1999-09-07
Lee, Eddie C.
Acoustics
Diaphragm and enclosure
181151, 181156, 181199, H05K 500, A47B 8106
Patent
active
059490330
ABSTRACT:
A loudspeaker enclosure having a constrained layer damping system for minimizing the propagation of vibrations and controlling the resonant modes of the enclosure. The enclosure has a front baffle board on which a plurality of transducers are mounted, and a plurality of other walls mounted to the baffle board to form a cabinet structure. The front baffle board comprises an interior substrate, an exterior substrate, and a constrained layer damping material sandwiched between and bonded to the two substrates. The constrained layer damping material comprises an energy absorbing thermoplastic alloy having a very high material loss factor. The other walls of the enclosure also comprise an interior substrate and an exterior substrate with a constrained layer damping material sandwiched therebetween. An extensional damping material may also be bonded to an interior surface of the interior substrates to further control vibrations in the enclosure.
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Kananen Ronald P.
Lee Eddie C.
Sony Corporation
Sony Electronics Inc.
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