Constant pH polish and scrub

Details Constant pH polish and scrub Constant pH polish and scrub

2005-04-05

2005-04-05

Rachuba, M. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S036000, C451S037000, C451S057000, C134S003000

Reexamination Certificate

active

06875089

ABSTRACT:
A system and method are provided that maintains a high pH at the wafer surface through the entire polish process and then lowers the pH only when necessary in a controlled fashion after CMP and during the post-polish clean. A fluid having a high pH chemistry and, optionally, surfactants is used instead of deionized water to keep the wafer and polisher components wet and to clean the slurry residue from the polishing pad.

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