Consistent grounding technique between components of high freque

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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361752, 361799, 361796, 439 65, 439 66, H05K 702

Patent

active

054281911

ABSTRACT:
A consistent, repeatable ground connection between a high frequency circuit board and a mating ground structure within a high frequency system is disclosed. The high frequency circuit board includes a dielectric layer located between a conductive backing and a microstrip transmission line. The conductive backing has a groove formed along one of its edges near the transmission line. An elastic, electrically conductive member is positioned within the groove so that it maintains electrical contact with the conductive backing and the mating ground structure. The invention reduces manufacturing costs by permitting less stringent manufacturing and machining tolerances, by eliminating the need for impedance matching between mating components, and by eliminating the need to utilize copper shims with adhesive backings between mating components. In addition, the invention maintains a consistent ground connection when the high frequency system is exposed to a range of operating temperatures.

REFERENCES:
patent: 5259770 (1993-11-01), Bates et al.
patent: 5280411 (1994-01-01), Dirks et al.

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