Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Patent
1996-03-19
2000-08-08
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
257772, 257723, 257724, 257693, H01L 2348, H01L 2352, H01L 2940, H01L 2334
Patent
active
061005967
ABSTRACT:
A connectorized substrate and method of connectorizing a substrate is provided, including a substrate having conductive traces mounted thereon and solder paste connected to the conductive traces and conductive spheres mounted to the solder paste. The connectorized substrate of the present invention may be used to provide for components to be added to a motherboard such as a resistor network by mounting resistors to the conductive traces of the substrate such as thick-film ceramic resistors.
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Daly John J.
Skepnek Robert
Clark Jhihan B.
Methode Electronics Inc.
Newman David L.
Saadat Mahshid D.
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