Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
1999-08-20
2001-02-27
Patel, T. C. (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S071000
Reexamination Certificate
active
06193524
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a connector, and more particularly to a connector having high densely arranged terminals to electrically connect to contacts on working element and printed circuit board through LGA (Leadless Grid Array) type connection.
BACKGROUND OF THE INVENTION
FIGS. 1 and 2
illustrate an IC structure disclosed in U.S. Pat. No. 5,702,255. The IC structure includes a cover
28
, a BGA (ball grid array) package
12
having semiconductor elements provided therein, and a connector main body
24
. From
FIG. 2
, it can be clearly seen that the BGA package
12
has ball-type contacts
20
that are connected to contact assemblies
26
provided on the connector main body
24
. The contact assemblies
26
have ball-shaped lower ends that are in contact with terminal pads
14
provided on a circuit board
16
. This is the so-called BGA type connection that is considered to be superior to the conventional SMT type connection.
There are different ways of arrangement of pins on a connector. The arrangement of pins disclosed in the above-mentioned U.S. Pat. No. 5,702,255 is shown in FIG.
3
, in which the pins are arranged in multiple longitudinal and transverse rows. That is, each circle in
FIG. 3
represents a position for one single pin, and each pin position has another four pin positions separately arranged at its front, rear, right, and left sides. A rate of use in one unit area provided by this type of arrangement of pins is 0.7854.
FIG. 4
shows another type of pin arrangement that is currently adopted in most conventional connectors. In this type of arrangement, pins are located on intersecting lines. That is, each pin position represented by a circle has another four pin positions spaced around it on two intersecting diagonal lines. The rate of use in one unit area provided by this type of pin arrangement is 0.7854 that is not good enough and needs improvement.
Currently, there is another LGA (Leadless Grid Array) type of connection widely adopted to connect working elements to a connector. The LGA type of connection is different from and superior to the conventional SMT and BGA types of connection in that it does not require any tin soldering. Working elements are electrically connected to the connector by forward contact with terminals in the connector. The LGA type of connection simplifies the connection in an IC structure and enables largely improved good yield of connection. Moreover, components employed in the BGA type connector can be applied to the connector adopting LGA type connection.
To achieve the LGA type connection, the working elements may have two different types of contacts, namely, a ball type contact C
1
and a plane type contact C
2
, as illustrated in
FIGS. 10A and 10B
, respectively. Both the ball and the plane type contacts are connected to the terminals on the connector without using tin soldering.
SUMMARY OF THE INVENTION
A primary object of the present invention is to provide a connector with high-densely arranged terminals. Pin positions of the connector are densely arranged in a staggered pattern to achieve an improved rate of use in one unit area up to 0.9069. And distances among individual pins can be increased to reduce noise, so that the connector could be used with a high-frequency working element. The connector with staggered terminals may be applied to general computer elements and to connect to a printed circuit board.
Another object of the present invention is to provide a connector with LGA type terminals. The terminals have upper and lower elastic portions that will tightly connect to contacts on working element and printed circuit board under forward pressures applied on the connector by the working element and the printed circuit board. And, both the upper and the lower elastic portions of the LGA type terminals may be differently shaped into either two dimension or three dimensions depending on actual needs.
REFERENCES:
patent: 4161346 (1979-07-01), Cherian et al.
patent: 5573435 (1996-11-01), Grabbe et al.
patent: 5791914 (1998-08-01), Loranger et al.
patent: 5800184 (1998-09-01), Lopergolo et al.
patent: 5957703 (1999-09-01), Arai et al.
Patel T. C.
Smith , Gambrell & Russell, LLP
Tekon Electronics Corp.
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