Connector with component removal means

Geometrical instruments

Patent

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Details

339 17CF, 339 45M, 339 75M, 324158F, 248363, H05K 100, H01R 1362

Patent

active

045602166

ABSTRACT:
An IC socket with a mechanism for removing an IC package mounted therein and which has terminals to be brought into contact with terminals of the IC socket, the IC socket has a socket body with terminals around a package receiving recess to receive terminals of the IC package, a cover pivotally attached to the socket body and pivotable to a closed position, a lock for locking the cover, and a suction cup attached to the under side of the cover for snugly retaining the IC package in said recess in said socket body when the cover is locked and holding said IC package thereon by suction when the cover is opened relative to the IC socket body for removing the IC package from the socket body. A mounting stem on the suction cup extends through a bore in the cover and a flange on the end of the mounting stem seats in a flange receiving recess. A pressing portion projecting inwardly from the cover presses the terminals of the IC package firmly into contact with the terminals of the socket body when the cover is closed. The suction end of the suction cup projects slightly outwardly from the free end of the pressing portion, whereby the IC package held on the suction cup is spaced slightly from the pressing portion when the cover is opened.

REFERENCES:
patent: 2175941 (1939-10-01), Keays
patent: 2936139 (1960-05-01), Lindstrom
patent: 3365161 (1968-01-01), Deitch
patent: 3391383 (1968-07-01), Antes
patent: 4196882 (1980-04-01), Rognon
patent: 4460223 (1984-07-01), Brown et al.
B. C. Abraham et al., "Automatic Wafer Transfer and Turnover Tool", Western Electric Technical Digest, No. 49, Jan. 1978, pp. 1-2.

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