Connector type semiconductor package

Details Connector type semiconductor package Connector type semiconductor package

1998-02-26

2000-07-18

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

257666, 257693, 257692, 257698, 257724, 257731, 257727, 361772, 439670, 439347, 439159, 439845, 439849, H01R 900, H01R 2372, H01R 3108, H03K 1324

Patent

active

060911476

ABSTRACT:
A connector type semiconductor package having a package mounting surface on a package main body, the connection direction of a signal connection connector being parallel to the package mounting surface, the package comprising a connector insertion portion provided in the package main body, the signal connection connector detachably inserted into the connector insertion portion, surface mount type electrical connection terminals provided at the package main body, and a step provided at a side where the connector insertion portion of the package main body is provided, for determining the height of the surface mount type electrical connection terminals.

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patent: 5742480 (1998-04-01), Sawada et al.
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R. A. Nordin, et al., "High Performance Optical Datalink Array Technology", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 16, No. 8, Dec. 1993, pp. 783-788.

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