Connector terminal fabrication process and connector terminal

Details Connector terminal fabrication process and connector terminal Connector terminal fabrication process and connector terminal

2006-01-19

2008-03-11

Vu, Hien (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

C439S886000, C439S931000

Reexamination Certificate

active

07341462

ABSTRACT:
An upper tier terminal is provided with a fitting portion and a board attachment portion. When the upper tier terminal is being fabricated, a first wire member which is a component of the fitting portion and a second wire member which is a component of the board attachment portion, whole peripheral surfaces of which have been subjected to a plating treatment beforehand, are employed. End portions of the first wire member and the second wire member are mutually superposed, and the first wire member and the second wire member are joined. Thus, the fitting portion is formed and the board attachment portion is formed. Hence, a surface of the upper tier terminal is structured by a plating layer at the peripheral surface of the first wire member and a plating layer at the peripheral surface of the second wire member. Consequently, a post-plating treatment can be rendered unnecessary.

REFERENCES:
patent: 2726376 (1955-12-01), Heath
patent: 4662702 (1987-05-01), Furuya
patent: 4870227 (1989-09-01), Saen et al.
patent: 5145383 (1992-09-01), Bowen et al.
patent: 5145413 (1992-09-01), Okamoto et al.
patent: 5175928 (1993-01-01), Grabbe
patent: 5980337 (1999-11-01), Little
patent: 2004/0116004 (2004-06-01), Kojima
patent: 2001-110491 (2001-04-01), None

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