Connector system having contact overlapping vias

Details Connector system having contact overlapping vias Connector system having contact overlapping vias

2011-08-30

2011-08-30

Abrams, Neil (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

08007287

ABSTRACT:
An electronic connector system includes an electronic package and an interposer connector assembly. The electronic package has a body with a conductive member disposed on a mating surface of the body. The conductive member is coupled with a conductive via that extends into the body and is oriented along a center axis. The interposer connector assembly includes a substrate with an elongated conductive pad mounted to the substrate and a contact joined to the conductive pad. The contact engages the conductive member when the electronic package mates with the interposer connector assembly such that the center axis extends through the contact.

REFERENCES:
patent: 5173055 (1992-12-01), Grabbe
patent: 5282312 (1994-02-01), DiStefano et al.
patent: 6074219 (2000-06-01), Tustaniwskyj et al.
patent: 6274820 (2001-08-01), DiStefano et al.
patent: 6302703 (2001-10-01), Bestul et al.
patent: 6392301 (2002-05-01), Waizman et al.
patent: 6905343 (2005-06-01), Neidich
patent: 2002/0055280 (2002-05-01), Ko
patent: 2002/0055282 (2002-05-01), Eldridge et al.
patent: 2004/0072456 (2004-04-01), Dozier et al.
patent: 2006/0163715 (2006-07-01), Pendse
patent: 2006/0232301 (2006-10-01), Morlion et al.

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