Data processing: measuring – calibrating – or testing – Testing system
Reexamination Certificate
2011-01-11
2011-01-11
Dunn, Drew A (Department: 2863)
Data processing: measuring, calibrating, or testing
Testing system
C439S620150, C439S620010
Reexamination Certificate
active
07869974
ABSTRACT:
An apparatus (130) including an integrated circuit (200 200a) and at least one coupler (302a302b) for electromagnetically coupling the integrated circuit (200 200a) to a conductor (323a323b), which may be man-made or naturally occurring, such as in a human or non-human animal. The coupling is electromagnetic, i.e. indirect, and not a result of a mechanical attachment, but instead via an electromagnetic field (or only an electric or magnetic component). The conductor (323a323b) may be suitable for conveying electronic or spintronic or optical signals, and the coupling is more specifically a coupling to the fields associated with such signals. The integrated circuit/chip (200 200a) can be electrical, optical, optoelectronic, or quantum, and can be of ordinary scale or nanoscale, and can make use of spintronic devices. A connector (100 100a) including such an apparatus (130) is also provided.
REFERENCES:
patent: 3154360 (1964-10-01), Plishner
patent: 3983546 (1976-09-01), Zappe
patent: 4038625 (1977-07-01), Tompkins et al.
patent: 4161692 (1979-07-01), Tarzwell
patent: 4839854 (1989-06-01), Sakami et al.
patent: 4862231 (1989-08-01), Abend
patent: 5006793 (1991-04-01), Gleason et al.
patent: 5054112 (1991-10-01), Ike
patent: 5432486 (1995-07-01), Wong
patent: 5629838 (1997-05-01), Knight et al.
patent: 5692925 (1997-12-01), Bogese, II
patent: 5786979 (1998-07-01), Douglass
patent: 5943199 (1999-08-01), Aromin
patent: 5977773 (1999-11-01), Medelius et al.
patent: 6354865 (2002-03-01), Bogese
patent: 6416334 (2002-07-01), Plishner
patent: 6449308 (2002-09-01), Knight, Jr. et al.
patent: 6496889 (2002-12-01), Perino et al.
patent: 6500696 (2002-12-01), Sutherland
patent: 6572402 (2003-06-01), Lin
patent: 6612852 (2003-09-01), Panella
patent: 6764347 (2004-07-01), Plishner
patent: 6773306 (2004-08-01), Plishner
patent: 6891447 (2005-05-01), Song
patent: 2004/0150311 (2004-08-01), Jin
patent: 27 52 783 (1979-01-01), None
patent: 0 573 714 (1993-12-01), None
patent: 0 676 710 (1995-10-01), None
patent: 1 206 012 (2002-05-01), None
patent: 2 237 129 (1991-04-01), None
patent: WO 2004/012265 (2004-02-01), None
Sasaki et al. (a compact optical active connector and optical interconnect module with an electrical connector interface, IEEE transactions on advance packaging, vol. 22, No. 4, Nov. 1999, pp. 541-550).
Sasaki et al. (IEEE, 1996 Electronic components and technology conference 1996, pp. 512-519).
Dec. 2002 issue of Microwave Journal, advertisement in.
Dec. 2002 issue of Microwave Products Digest, advertisement in.
Dec. 2002 issue of Maritime Reporter, advertisement in.
Estimated Dec. 2002 issue of Microwave Products Digest, advertisement in.
News & Views, Nanotubes Strong Bundles, Natures Materials 3, 136-136 (Mar. 2004), (as published on the Internet).
The New.York Times, (nytimes.com), Apr. 8, 2004, What's Next Refining Semiconductors, One Atom at a Time, By Anne Eisenberg, (as published on the Internet).
Quantum Entanglement from Wikipedia, the free encyclopedia, web page en.wikipedia.org, (as published on the Internet).
Gridpoints the Quarterly Publication of the Numerical Aerospace Simulation Systems Division, Summer 2000, NAS researchers are developing atomic scale transistors to enable future microelectronics (see p. 10), web page www.nas.nasa.gov/gridpoints, (as published on the Internet).
AMBIT Corporation, Nanotechnology, Antenna Systems, and Pressures . . . , carbon nanostructures, web page at ambitcorp.com, (as published on the Internet).
T. Mangold et al., “A multichip module integration technology on silicon substrate for high frequency applications,” 4 pages.
N. Rinaldi et al., “U.C.A.N.'s ultra wide band system: baseband algorithm design,” Apr. 2003, 6 pages.
O. Albert et al., “Low-power ultra-wideband radio testbed for short-range data transmission,” 6 pages.
N. M. Khan et al., “Use of state-space approach and Kalman filter estimation in channel modeling for multiuser detection in time-varying environment,” 5 pages.
A. L. Sigvartsen, “Inside the AMD Hammer microprocessor—AMD's next generation microprocessor architecture (Fred Weber),” Oct. 22, 2001, infosatellite.com
ews, 15 pages.
D. Salzman et al., “Manufacturability of capacitively coupled multichip modules,” IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, vol. 18, No. 2, May 1995, pp. 277-281.
D. Salzman et al., “Application of capacitive coupling to switch fabrics,” IEEE 1994, pp. 195-199.
D. Salzman et al., “Capacitively coupled multichip modules,” MCM '94 Proceedings, pp. 487-494.
M. F. Chang et al., “RF/wireless interconnect for inter- and intra-chip communications,” Proceedings of the IEEE, vol. 89, No. 4, Apr. 2001, pp. 456-466.
J. D. Meindl et al., “Interconnecting device opportunities for gigascale integration (GSI),” IEEE 2001, pp. 23.1.1-23.1.4.
D. Salzman et al., “Capacitive coupling solves the known good die problem,” IEEE 1994, pp. 95-100.
R. Yung et al., “Future trend of microprocessor design (invited paper),” ESSCIRC 2002, pp. 43-46.
M. Kuijk et al., “Integration of CMOS-VLSI and light emitting sources by capacitive coupling,” Electronics Letters, Oct. 9, 1997, vol. 33, No. 21, 2 pages.
R. J. Drost et al., “Proximity communication,” IEEE 2003 Custom Integrated Circuits Conference, pp. 469-472.
S. Mick et al., “4 Gbps high-density AC coupled interconnection (invited paper),” IEEE 2002 Custom Integrated Circuits Conference, pp. 133-140.
K. Kanda et al., “1.27 Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme,” ISSCC 2003/Session 10/High Speed Building Blocks/Paper 10.7, IEEE 2003 International Solid-State Circuits Conference, 10 pages.
Dunn Drew A
Fressola Alfred A.
Vo Hien X
Ware Fressola Van Der Sluys & Adolphson LLP
LandOfFree
Connector or other circuit element having an indirectly... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Connector or other circuit element having an indirectly..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Connector or other circuit element having an indirectly... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2687664