Radiant energy – Ionic separation or analysis – Static field-type ion path-bending selecting means
Patent
1980-12-30
1983-02-15
Lee, John D.
Radiant energy
Ionic separation or analysis
Static field-type ion path-bending selecting means
250227, 339 17R, G02B 726
Patent
active
043737781
ABSTRACT:
A single level packaging arrangement and connector for large or very large scale integrated circuit chips is disclosed. This arrangement utilizes dual function optical transducers and fiber optic cables as the transmission medium by which most, if not all, chip I/O communication is effected.
The top portion of the connector acts as a conductive collar which serves as both a heat sink and a shield against stray external signals. A chip site is formed in the top portion of the connector and the chip removably lodged therein. The top portion of the connector also includes connector pads which are utilized to make solderless connection to deformable chip pads and to dual purpose optical transducers. Thermal grease, which is forced into and fills site cavities provided for that purpose, assists in conducting heat from within the connector to thereby enhance the heat dissipation characteristics of the chip site. The chip itself is retained in the site by the use of wedges and retaining strips secured to the connector at appropriate locations therein.
The bottom portion of the connector is provided with a first group of holes that house the optical transducers in operative alignment with the bottoms of predetermined ones of the site connector pins. A second group of holes in the bottom portion includes the optical cables that couple the chip's I/O pads to selected circuits and/or devices. The top and bottom connector portions are joined together by suitable means.
REFERENCES:
patent: 2416887 (1947-03-01), Tibbetts
patent: 3879606 (1975-04-01), Bean
patent: 3904262 (1975-09-01), Cutchaw
patent: 3963920 (1976-06-01), Palmer
patent: 3969816 (1976-07-01), Swengel, Sr. et al.
patent: 4030190 (1977-06-01), Varker
patent: 4063791 (1977-12-01), Cutchaw
patent: 4081208 (1978-03-01), Meade
patent: 4164003 (1979-08-01), Cutchaw
patent: 4166665 (1979-09-01), Cutchaw
patent: 4225213 (1980-09-01), McBride, Jr. et al.
Albanese et al, "Led Array Package for Optical Data Links," Bell Syst. Tech. Journal, vol. 58, No. 3, Mar. 1979, pp. 713-720.
Redmond, "Completely Integrated Fiber-Optic Link," IBM Tech. Discl. Bull., vol. 22, No. 9, Feb. 1980, pp. 3975-3976.
Noel et al, "High Density Fiber-Optic Transducer Modules," IBM Tech. Discl. Bull., vol. 22, No. 11, Apr. 1980, pp. 4857-4858.
International Business Machines - Corporation
Lee John D.
Seinberg Saul A.
LandOfFree
Connector implemented with fiber optic means and site therein fo does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Connector implemented with fiber optic means and site therein fo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Connector implemented with fiber optic means and site therein fo will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1797886