Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1986-07-31
1987-10-13
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439680, 439862, H01R 2372
Patent
active
046995935
ABSTRACT:
Connector for a substrate such as an IC chip carrier comprises a housing assembly which in turn comprises a housing frame and a plurality of contact modules on the frame. Each module has a group of contact members therein. The contact members are located in predetermined positions in the frame and within predetermined dimensional tolerances. The housing frame and the substrate have substrate locating means for locating the substrate so that contact pads on the substrate will be in registry with the contact positions. Module locating means are also provided for locating the modules in the frame so that the contact members in the modules will be located in the predetermined positions. Each module has its own locating means which is directly related to the substrate locating means. The contact members in each module are thereby located within cumulative dimensional tolerances which are limited to the respective modules and are not cumulative beyond the individual modules.
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IBM Bulletin, Dust, vol. 15, No. 1, p. 108, 6-1972.
Grabbe Dimitry G.
Korsunsky Iosif
Abrams Neil
AMP Incorporated
Raring Frederick W.
Wolstoncroft Bruce J.
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