Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-03-27
2007-03-27
Ta, Tho D. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
10558486
ABSTRACT:
A socket body is reinforced by inserted or press-fitted reinforcing members inserted so that a protruding table is eliminated and a width dimension thereof is reduced. Each socket contact has a first contact portion formed in substantially U-shape for elastically deformable. A header body has concave portions on upper face of the socket body (SIC). Each header post has a second contact portion disposed along a side wall of the header body and to be contacted with a first contact portion of the socket contact, and a curved portion formed in substantially reverse U-shape toward the concave portion from a vicinity of an upper end portion of the side wall of the header body. A curvature radius of the curved portion of the header post is established to be the smallest in a scope that a free end of the first contact portion of the socket contact contacts in the second contact portion side from a peak of the curved portion, and the socket contact is rarely buckled due to scratching with the curved portion.
REFERENCES:
patent: 5975916 (1999-11-01), Okura
patent: 6793506 (2004-09-01), Hirata et al.
patent: 6811411 (2004-11-01), Hirata et al.
patent: 6827588 (2004-12-01), Huang et al.
patent: 6-011268 (1994-02-01), None
patent: 11-111873 (1994-04-01), None
patent: 11-260505 (1999-09-01), None
patent: 11-329622 (1999-11-01), None
patent: 2002-008753 (2002-01-01), None
patent: 2003-017162 (2003-01-01), None
patent: 2004-055464 (2004-02-01), None
patent: 2004-111081 (2004-04-01), None
English Language Abstract of JP 2002-008753.
English Language Abstract of JP 2003-017162.
English Language Abstract of JP11-260505.
English Language Abstract of JP 6-011268.
English Language Abstract of JP 2004-055464.
English Language Abstract of JP 11-329622.
English Language Abstract of JP 6-111873.
English Language Abstract of JP 2004-111081.
U.S. Appl. No. 10/561,527 to Ookura, filed Dec. 20, 2005.
U.S. Appl. No. 10/561,526 to Ookura, filed Dec. 20, 2005.
Greenblum & Bernstein P.L.C.
Matsushita Electric & Works Ltd.
Ta Tho D.
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