Metal treatment – Stock – Copper base
Reexamination Certificate
2005-09-27
2005-09-27
Ip, Sikyin (Department: 1742)
Metal treatment
Stock
Copper base
C148S433000, C148S434000, C148S435000, C148S436000
Reexamination Certificate
active
06949150
ABSTRACT:
Copper alloy having the basic composition Cu—Zn—Sn contains 23-28 wt % Zn and 0.3-1.8 wt % Sn and satisfies the relation 6.0≦0.25X+Y≦8.5 (where X is the addition of Zn in wt % and Y is the addition of Sn in wt %). The alloy is cast into an ingot by melting and cooling over the range from the liquidus line to 600° C. at a rate of at least 50° C./min; the ingot is hot rolled at a temperature not higher than 900° C. and then subjected to repeated cycles of cold rolling and annealing at 300-650° C. to control the size of crystal grains, thereby producing a rolled strip having a 0.2% yield strength of at least 600 N/mm2, a tensile strength of at least 650 N/mm2, an electrical conductivity of at least 20% IACS, a Young's modulus of no more than 120 kN/mm2and a percent stress relaxation of no more than 20%.
REFERENCES:
patent: 4205984 (1980-06-01), Smith, Jr. et al.
patent: 6132528 (2000-10-01), Brauer et al.
patent: 6627011 (2003-09-01), Sugawara et al.
patent: 6699337 (2004-03-01), Hatakeyama et al.
patent: 2004/0140022 (2004-07-01), Inohana et al.
patent: 2951768 (1981-07-01), None
patent: 62-146230 (1987-06-01), None
patent: 62-227071 (1987-10-01), None
patent: 62-243750 (1987-10-01), None
patent: 10-195562 (1998-07-01), None
Hatakeyama Kazuki
Ling Le
Sugawara Akira
Dowa Mining Co. Ltd.
Frishauf Holtz Goodman & Chick P.C.
Ip Sikyin
LandOfFree
Connector copper alloys and a process for producing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Connector copper alloys and a process for producing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Connector copper alloys and a process for producing the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3396644