Connector assembly with a connecting means to board and arrangin

Details Connector assembly with a connecting means to board and arrangin Connector assembly with a connecting means to board and arrangin

1997-12-08

1999-09-07

Donovan, Lincoln

Electrical connectors

Including or for use with tape cable

439 67, 439 82, H01R 907

Patent

active

059477644

ABSTRACT:
A connector assembly (10, 10') for receiving electrical cards seated on a rigid mother board (12, 12'), includes the plural electrical card connectors (20, 20'), a flexible printed circuit (50, 50') and a connecting means (30, 30') wherein the plural connectors (20, 20') further includes an insulative housing (26, 26') means receiving a plurality of contacts (24, 24') and a shell means (40, 40') integrally forming a plurality of terminal (44, 44') therewith. The flexible printed circuit board (50, 50') includes a plurality of holes (521, 521') formed adjacent to an end thereof and solderably connected with the terminals (44, 44') and the contacts (24, 24') of the connectors (20, 20'), and a plurality of printed pads (581, 581') formed adjacent to the other end thereof and electrically connected with a plurality of circuit pads (18, 18') formed on the rigid mother board (12, 12') by means of the connecting means (30, 30'). Since the electrical connection between the electrical card connectors (20, 20') and the rigid mother board (12, 12') only utilizes one flexible printed circuit board (50, 50') and one connecting means (30, 30'), the connector assembly (10, 10') can save more space on the rigid mother board (12, 12') and achieve a shorter electrical transmittal path.

REFERENCES:
patent: 4894015 (1990-01-01), Stockero et al.
patent: 5123851 (1992-06-01), Young et al.
patent: 5163836 (1992-11-01), Young et al.
patent: 5194010 (1993-03-01), Dambach et al.
patent: 5324204 (1994-06-01), Lwee
patent: 5330365 (1994-07-01), Leeson
patent: 5334046 (1994-08-01), Brouillette et al.
patent: 5364275 (1994-11-01), Ota et al.
patent: 5752851 (1998-05-01), Zaderej et al.

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