Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1993-11-12
1995-07-25
Ramsey, Kenneth J.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 71, 361785, 324762, H01L 2160
Patent
active
054357330
ABSTRACT:
A Multi-Chip-Module or MCM (66) is mounted on a supporting motherboard (64). A plurality of first contact pads (99) are formed on the module (66) adjacent to its peripheral edge for interconnection with microelectronic components (70,72,74,76,78) mounted on the module (66). Second contact pads (94) are formed on the motherboard (64) adjacent to respective first contact pads (99). A flexible cable (96) includes controlled impedance microstrip or stripline conductor (98) with first and second gold dots (100,102) at their ends. A frame (104) resiliently presses the first and second gold dots (100, 102) into connection with respective first and second contacts (99,94) for interconnection thereof. The components (70, 72,74,76,78) on the module (66) can be hermetically sealed by a cover (80), and the module (66) and cable (96) can be hermetically sealed by a first resilient ring (112) which is compressed between the frame (104) and the cover (80), and a second resilient ring (114) which is compressed between the frame (104) and the motherboard (64). Alternatively, the cover (80) and the first ring (112) can be replaced by a cover (104a) which is integral with a frame (104'). An alternative connector (136) includes a flexible cable (146) which extends around an edge of a frame (144) to enable vertical stacking of MCMs (164) and/or backplanes (138) in any combination.
REFERENCES:
patent: Re31114 (1982-12-01), Berg
patent: 3924915 (1975-12-01), Conrad
patent: 4125310 (1978-11-01), Reardon, II et al.
patent: 4164003 (1979-08-01), Cutchaw
patent: 4194800 (1980-03-01), Chow
patent: 4453795 (1984-06-01), Moulin
patent: 4878846 (1989-11-01), Schroeder
patent: 5059898 (1991-10-01), Barsotti et al.
patent: 5104327 (1992-04-01), Walburn
patent: 5194698 (1993-03-01), Souto et al.
patent: 5197184 (1993-03-01), Crumly et al.
patent: 5207887 (1993-05-01), Crumly et al.
patent: 5245135 (1993-09-01), Schreiber et al.
patent: 5309324 (1994-05-01), Herandez et al.
L. Palmieri, "Performance Characterization of VAX 9000 MCU Flexible Circuit Interconnect", Circuit World, vol. 18, No. 3, 1992 (date, page nos. unknown).
Chernicky Gerald P.
Feigenbaum Haim
Kovacs Alan L.
Le Bao Q.
Schreiber Christopher M.
Denson-Low W. K.
Gudmestad Terje
Hughes Aircraft Company
Leitereg Elizabeth E.
Ramsey Kenneth J.
LandOfFree
Connector assembly for microelectronic multi-chip-module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Connector assembly for microelectronic multi-chip-module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Connector assembly for microelectronic multi-chip-module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-736757